3581J

更新时间： 2024-02-03 13:33:46

品牌	Logo	应用领域
BB		运算放大器放大器电路高压局域网
页数	文件大小	规格书
6页	2323K
描述
HIGH VOLTAGE OPERATIONAL AMPLIFIERS

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3581J 技术参数

是否Rohs认证：	不符合	生命周期：	Obsolete
Reach Compliance Code：	unknown	风险等级：	5.83
放大器类型：	OPERATIONAL AMPLIFIER	架构：	VOLTAGE-FEEDBACK
25C 时的最大偏置电流 (IIB)：	0.00002 µA	频率补偿：	YES
最大输入失调电压：	3000 µV	JESD-30 代码：	O-MBCY-W8
JESD-609代码：	e0	低-偏置：	YES
低-失调：	NO	标称负供电电压 (Vsup)：	-75 V
功能数量：	1	端子数量：	8
最高工作温度：	70 °C	最低工作温度：
封装主体材料：	METAL	封装等效代码：	CAN8/9,.5FL
封装形状：	ROUND	封装形式：	CYLINDRICAL
功率：	YES	电源：	+-75 V
子类别：	Operational Amplifiers	最大压摆率：	8 mA
标称供电电压 (Vsup)：	75 V	技术：	HYBRID
温度等级：	COMMERCIAL	端子面层：	Tin/Lead (Sn/Pb)
端子形式：	WIRE	端子位置：	BOTTOM
最小电压增益：	50000	Base Number Matches：	1

3581J 数据手册

PACKAGE OPTION ADDENDUM

www.ti.com

10-Mar-2006

PACKAGING INFORMATION

Orderable Device

Status ⁽¹⁾

Package Package

Pins Package Eco Plan ⁽²⁾Lead/Ball Finish MSL Peak Temp ⁽³⁾

Qty

Type

Drawing

3581J

NRND

TO-3

LMF

18 Pb-Free (RoHS

Exempt)

Call TI

N / A for Pkg Type

⁽¹⁾The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in

a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2)

Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check

http://www.ti.com/productcontent for the latest availability information and additional product content details.

TBD: The Pb-Free/Green conversion plan has not been defined.

Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements

for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered

at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.

Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and

package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS

compatible) as defined above.

Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame

retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)

(3)

MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder

temperature.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is

provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the

accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take

reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on

incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited

information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI

to Customer on an annual basis.

Addendum-Page 1

1 2 3 456

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