5.2.1 Thermal Monitor .....................................................................................80
5.2.2 Thermal Monitor 2 ..................................................................................81
5.2.3 On-Demand Mode...................................................................................82
5.2.4 PROCHOT# Signal ..................................................................................83
5.2.5 THERMTRIP# Signal................................................................................83
Platform Environment Control Interface (PECI) ......................................................84
5.3.1 Introduction...........................................................................................84
5.3.1.1 Key Difference with Legacy Diode-Based Thermal Management .......84
5.3.2 PECI Specifications .................................................................................86
5.3.2.1 PECI Device Address..................................................................86
5.3.2.2 PECI Command Support.............................................................86
5.3.2.3 PECI Fault Handling Requirements...............................................86
5.3.2.4 PECI GetTemp0() Error Code Support ..........................................86
5.3
6
Features ..................................................................................................................87
6.1
6.2
Power-On Configuration Options ..........................................................................87
Clock Control and Low Power States.....................................................................87
6.2.1 Normal State .........................................................................................88
6.2.2 HALT and Extended HALT Powerdown States ..............................................88
6.2.2.1 HALT Powerdown State ..............................................................88
6.2.2.2 Extended HALT Powerdown State ................................................89
6.2.3 Stop Grant and Extended Stop Grant States...............................................89
6.2.3.1 Stop Grant State.......................................................................89
6.2.3.2 Extended Stop Grant State.........................................................90
6.2.4 Extended HALT Snoop State, HALT Snoop State, Extended Stop Grant Snoop
State, and Stop Grant Snoop State ...........................................................90
6.2.4.1 HALT Snoop State, Stop Grant Snoop State ..................................90
6.2.4.2 Extended HALT Snoop State, Extended Stop Grant Snoop State.......90
Enhanced Intel® SpeedStep® Technology............................................................90
6.3
7
Boxed Processor Specifications................................................................................93
7.1
Mechanical Specifications....................................................................................94
7.1.1 Boxed Processor Cooling Solution Dimensions.............................................94
7.1.2 Boxed Processor Fan Heatsink Weight .......................................................95
7.1.3 Boxed Processor Retention Mechanism and Heatsink Attach Clip Assembly .....95
Electrical Requirements ......................................................................................95
7.2.1 Fan Heatsink Power Supply ......................................................................95
Thermal Specifications........................................................................................97
7.3.1 Boxed Processor Cooling Requirements......................................................97
7.3.2 Variable Speed Fan.................................................................................99
7.2
7.3
8
Debug Tools Specifications ....................................................................................101
8.1
Logic Analyzer Interface (LAI) ...........................................................................101
8.1.1 Mechanical Considerations .....................................................................101
8.1.2 Electrical Considerations........................................................................101
4
Dual-Core Intel® Xeon® Processor 3000 Series Datasheet
5秒后页面跳转
SI2301 N沟道MOSFET：资料手册参数分析
ADC0809逐次逼近寄存器型模数转换器：资料手册参数分析
AD9361捷变收发器：全面参数解析与关键特性概览
IRF3205功率MOSFET：资料手册参数分析
微信公众号
抖音公众号
浙公网安备 33010502006866号 浙ICP备10014259号-119
营业执照ICP证
数据手册
如果您发现信息不准确，
