30TB16FW_1.5 series
30W - Single Output - Wide Input - Isolated & Regulated
DC-DC Converter
Output voltage programming
Circuit configuration to decrease output voltage
To decrease the output voltage (see figure on the left), a trim
resistor, R, should be connected between the TRIM and -S, with
a value of:
Trimming beyond 110% of the rated output voltage is not an
acceptable design practice, as this condition could cause
unwanted triggering of the output overvoltage protection
(OVP) circuit. When trimming up, care must be taken not to
exceed the converter’s maximum allowable output power.
Heat transfer via convection
Over temperature protection
Recommended airflow direction
Tref Temperature Measurement Location
Recommended reflow profile
Lead-free (Pb-free) solder processes
For Pb-free solder processes, a pin temperature (TPIN) in excess of the sol-
der melting temperature (TL, +217°C to +221°C for Sn/Ag/Cu solder alloys)
for more than 30 seconds, and a peak temperature of +235°C on all solder
joints is recommended to ensure a reliable solder joint.
For Pb-free solder processes, the product is qualified for MSL 3 according to
IPC/JEDEC standard J-STD-020C. During reflow, TP must not exceed +245°C
at any time.
Page 5 of 6
30TB16FW_1.5 – Rev. 2020-1.0
Specifications subject to change without notice.
GAPTEC-Electronic GmbH & Co. KG
sales@gaptec-electronic.com – www.gaptec-electronic.com