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30CTQ100-N3 PDF预览

30CTQ100-N3

更新时间: 2022-05-13 06:10:49
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
7页 174K
描述
Schottky Rectifier, 2 x 15 A

30CTQ100-N3 数据手册

 浏览型号30CTQ100-N3的Datasheet PDF文件第1页浏览型号30CTQ100-N3的Datasheet PDF文件第2页浏览型号30CTQ100-N3的Datasheet PDF文件第3页浏览型号30CTQ100-N3的Datasheet PDF文件第4页浏览型号30CTQ100-N3的Datasheet PDF文件第5页浏览型号30CTQ100-N3的Datasheet PDF文件第7页 
Outline Dimensions  
Vishay Semiconductors  
TO-220AB  
DIMENSIONS in millimeters and inches  
B
Seating  
plane  
A
A
(6)  
Thermal pad  
E
Ø P  
0.014 B A  
A
(E)  
M
M
(7)  
E2  
A1  
1
3
Q
2
D
D
C
(6)  
(H1)  
H1  
(2)  
L1  
(7)  
C
(6)  
D2  
D
Detail B  
(6)  
D1  
3 x b  
3 x b2  
1
3
2
Detail B  
C
E1 (6)  
L
(b, b2)  
b1, b3  
Base metal  
Plating  
View A - A  
c1  
(4)  
c
c
A
2 x e  
e1  
(4)  
A2  
Section C - C and D - D  
M
M
0.015 B A  
Lead assignments  
Lead tip  
Diodes  
Conforms to JEDEC outline TO-220AB  
1. - Anode/open  
2. - Cathode  
3. - Anode  
MILLIMETERS  
INCHES  
MILLIMETERS  
INCHES  
MIN.  
0.398  
0.270  
-
SYMBOL  
NOTES  
SYMBOL  
NOTES  
MIN.  
4.25  
1.14  
2.56  
0.69  
0.38  
1.20  
1.14  
0.36  
0.36  
14.85  
8.38  
11.68  
MAX.  
4.65  
1.40  
2.92  
1.01  
0.97  
1.73  
1.73  
0.61  
0.56  
15.25  
9.02  
12.88  
MIN.  
0.167  
0.045  
0.101  
0.027  
0.015  
0.047  
0.045  
0.014  
0.014  
0.585  
0.330  
0.460  
MAX.  
0.183  
MIN.  
10.11  
6.86  
-
MAX.  
10.51  
8.89  
0.76  
2.67  
5.28  
6.48  
14.02  
3.82  
3.73  
3.00  
MAX.  
0.414  
0.350  
0.030  
0.105  
0.208  
0.255  
0.552  
0.150  
0.147  
0.118  
A
A1  
A2  
b
E
E1  
E2  
e
3, 6  
6
0.055  
0.115  
0.040  
0.038  
0.068  
0.068  
0.024  
0.022  
0.600  
0.355  
0.507  
7
2.41  
4.88  
6.09  
13.52  
3.32  
3.54  
2.60  
0.095  
0.192  
0.240  
0.532  
0.131  
0.139  
0.102  
b1  
b2  
b3  
c
c1  
D
4
4
e1  
H1  
L
6, 7  
2
L1  
Ø P  
Q
4
3
D1  
D2  
90° to 93°  
90° to 93°  
6
Notes  
(1)  
(2)  
(3)  
(7)  
(8)  
Dimensioning and tolerancing as per ASME Y14.5M-1994  
Lead dimension and finish uncontrolled in L1  
Dimension D, D1 and E do not include mold flash. Mold flash  
shall not exceed 0.127 mm (0.005") per side. These dimensions  
are measured at the outermost extremes of the plastic body  
Dimension b1, b3 and c1 apply to base metal only  
Controlling dimensions: inches  
Dimensions E2 x H1 define a zone where stamping and  
singulation irregularities are allowed  
Outline conforms to JEDEC TO-220, except A2 (maximum) and  
D2 (minimum) where dimensions are derived from the actual  
package outline  
(4)  
(5)  
(6)  
Thermal pad contour optional within dimensions E, H1, D2 and  
E1  
Document Number: 95222  
Revision: 08-Mar-11  
For technical questions within your region, please contact one of the following:  
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com  
www.vishay.com  
1

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