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300834 PDF预览

300834

更新时间: 2022-12-18 10:48:51
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
104页 3687K
描述
Dual-Core Intel Xeon Processor

300834 数据手册

 浏览型号300834的Datasheet PDF文件第2页浏览型号300834的Datasheet PDF文件第3页浏览型号300834的Datasheet PDF文件第4页浏览型号300834的Datasheet PDF文件第6页浏览型号300834的Datasheet PDF文件第7页浏览型号300834的Datasheet PDF文件第8页 
8-1  
Boxed Dual-Core Intel Xeon Processor 5000 Series 1U  
Passive/2U Active Combination Heat Sink (With Removable Fan) ............................. 89  
Boxed Dual-Core Intel Xeon Processor 5000 Series 2U Passive Heat Sink.................. 90  
2U Passive Dual-Core Intel Xeon Processor 5000 Series  
8-2  
8-3  
Thermal Solution (Exploded View) ....................................................................... 90  
Top Side Board Keep-Out Zones (Part 1) .............................................................. 92  
Top Side Board Keep-Out Zones (Part 2) .............................................................. 93  
Bottom Side Board Keep-Out Zones..................................................................... 94  
Board Mounting Hole Keep-Out Zones.................................................................. 95  
Volumetric Height Keep-Ins ................................................................................ 96  
4-Pin Fan Cable Connector (For Active CEK Heat Sink) ........................................... 97  
8-4  
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8-7  
8-8  
8-9  
8-10 4-Pin Base Board Fan Header (For Active CEK Heat Sink)........................................ 98  
8-11 Fan Cable Connector Pin Out for 4-Pin Active CEK Thermal Solution ....................... 100  
Tables  
1-1  
Dual-Core Intel® Xeon® Processor 5000 Series Features ....................................... 10  
Core Frequency to FSB Multiplier Configuration ..................................................... 17  
BSEL[2:0] Frequency Table ................................................................................ 17  
Voltage Identification Definition........................................................................... 19  
Loadline Selection Truth Table for LL_ID[1:0] ....................................................... 20  
Market Segment Selection Truth Table for MS_ID[1:0]........................................... 20  
FSB Signal Groups............................................................................................. 22  
Signal Description Table..................................................................................... 23  
Signal Reference Voltages .................................................................................. 23  
Processor Absolute Maximum Ratings................................................................... 24  
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2-9  
2-10 Voltage and Current Specifications....................................................................... 25  
2-11 VCC Static and Transient Tolerance ..................................................................... 28  
2-12 BSEL[2:0], VID[5:0] Signal Group DC Specifications.............................................. 30  
2-13 AGTL+ Signal Group DC Specifications ................................................................. 30  
2-14 PWRGOOD Input and TAP Signal Group DC Specifications ....................................... 30  
2-15 GTL+ Asynchronous and AGTL+ Asynchronous Signal Group  
DC Specifications .............................................................................................. 31  
2-16 VTTPWRGD DC Specifications.............................................................................. 31  
2-17 VCC Overshoot Specifications.............................................................................. 32  
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6-9  
Package Loading Specifications ........................................................................... 37  
Package Handling Guidelines............................................................................... 38  
Processor Materials............................................................................................ 38  
Land Listing by Land Name................................................................................. 43  
Land Listing by Land Number.............................................................................. 52  
Signal Definitions .............................................................................................. 61  
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Specifications ........ 70  
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile A Table ....... 71  
Dual-Core Intel Xeon Processor 5000 Series (1066 MHz) Thermal Profile B Table ....... 72  
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Specifications.......... 72  
Dual-Core Intel Xeon Processor 5000 Series (667 MHz) Thermal Profile A Table......... 73  
Dual-Core Intel Xeon 5000 Series (667 MHz) Thermal Profile B Table ....................... 74  
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Specifications ........................... 74  
Dual-Core Intel Xeon Processor 5063 (MV) Thermal Profile Table............................. 75  
Thermal Diode Parameters using Diode Model ....................................................... 80  
6-10 Thermal Diode Interface..................................................................................... 81  
6-11 Thermal Diode Parameters using Transistor Model ................................................. 81  
6-12 Parameters for Tdiode Correction Factor............................................................... 81  
Dual-Core Intel® Xeon® Processor 5000 Series Datasheet  
5

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