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300834

更新时间： 2022-12-18 10:48:51

品牌	Logo	应用领域
英特尔 - INTEL		/
页数	文件大小	规格书
104页	3687K
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Dual-Core Intel Xeon Processor

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300834 数据手册

Debug Tools Specifications

9.3.1

Mechanical Considerations

The LAI is installed between the processor socket and the processor. The LAI plugs into

the socket, while the processor plugs into a socket on the LAI. Cabling that is part of

the LAI egresses the system to allow an electrical connection between the processor

and a logic analyzer. The maximum volume occupied by the LAI, known as the keepout

volume, as well as the cable egress restrictions, should be obtained from the logic

analyzer vendor. System designers must make sure that the keepout volume remains

unobstructed inside the system. Note that it is possible that the keepout volume

reserved for the LAI may include differerent requirements from the space normally

occupied by the heatsink. If this is the case, the logic analyzer vendor will provide a

cooling solution as part of the LAI.

9.3.2

Electrical Considerations

The LAI will also affect the electrical performance of the FSB, therefore it is critical to

obtain electrical load models from each of the logic analyzer vendors to be able to run

system level simulations to prove that their tool will work in the system. Contact the

logic analyzer vendor for electrical specifications and load models for the LAI solution

they provide.

104

Dual-Core Intel® Xeon® Processor 5000 Series Datasheet

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型号	品牌	描述	获取价格	数据表
300835	INTEL	Dual-Core Intel Xeon Processor	获取价格
300850	AMPHENOL	Circular Connector	获取价格
3008-W	ETC	KNOB	获取价格
3008W8PXX99A10X	CONEC	Combination D-SUB without contacts, For straight high power, coaxial or high voltage conta	获取价格
3008W8PXX99A30X	CONEC	Combination D-SUB without contacts, For straight high power, coaxial or high voltage conta	获取价格
3008W8PXX99A50X	CONEC	D Subminiature Connector, 8 Contact(s), Male-Female, Solder Terminal, Plug, ROHS COMPLIANT	获取价格