Transistor
2SD1350, 2SD1350A
Silicon NPN triple diffusion planer type
For high breakdown voltage switching
Unit: mm
Features
High collector to base voltage VCBO
■
●
.
6.9±0.1
2.5±0.1
1.5
●
●
●
●
High collector to emitter voltage VCEO
Large collector power dissipation PC.
Low collector to emitter saturation voltage VCE(sat)
M type package allowing easy automatic and manual insertion as
well as stand-alone fixing to the printed circuit board.
.
1.5 R0.9
1.0
R0.9
.
R0.7
Absolute Maximum Ratings (Ta=25˚C)
■
0.85
Parameter
Symbol
Ratings
Unit
0.55±0.1
0.45±0.05
Collector to
2SD1350
2SD1350A
2SD1350
400
VCBO
V
base voltage
Collector to
600
3
2
1
400
VCEO
V
emitter voltage 2SD1350A
Emitter to base voltage
Peak collector current
Collector current
500
2.5
2.5
VEBO
ICP
5
V
A
1
1:Base
IC
500
1
mA
W
2:Collector
3:Emitter
EIAJ:SC–71
M Type Mold Package
*
Collector power dissipation
Junction temperature
Storage temperature
PC
Tj
150
˚C
˚C
Tstg
–55 ~ +150
*
Printed circuit board: Copper foil area of 1cm2 or more, and the board
thickness of 1.7mm for the collector portion
Electrical Characteristics (Ta=25˚C)
■
Parameter
Collector to base
voltage
Symbol
Conditions
IC = 100µA, IE = 0
min
400
600
400
500
5
typ
max
Unit
2SD1350
VCBO
V
2SD1350A
Collector to emitter 2SD1350
VCEO
IC = 500µA, IB = 0
IE = 100µA, IC = 0
V
V
voltage
2SD1350A
Emitter to base voltage
VEBO
hFE
Forward current transfer ratio
VCE = 5V, IC = 30mA
30
Collector to emitter saturation voltage VCE(sat)
Base to emitter saturation voltage VBE(sat)
IC = 250mA, IB = 50mA*
IC = 250mA, IB = 50mA*
1.5
1.5
V
V
Transition frequency
fT
VCB = 30V, IE = –20mA, f = 200MHz
VCB = 30V, IE = 0, f = 1MHz
VCC = 200V, IC = 100mA
55
MHz
pF
Collector output capacitance
Cob
7
2SD1350
0.4
1.0
0.7
1.0
3.6
4.0
Turn-on time
Fall time
ton
µs
µs
µs
2SD1350A
2SD1350
IB1 = 10mA, IB2 = –10mA
VCC = 200V, IC = 100mA
IB1 = 10mA, IB2 = –10mA
VCC = 200V, IC = 100mA
IB1 = 10mA, IB2 = –10mA
tf
2SD1350A
2SD1350
Storage time
tstg
2SD1350A
* Pulse measurement
1