Datasheet > 2QSP24-TF6-103/203LF

2QSP24-TF6-103/203LF

更新时间： 2023-08-15 00:00:00

品牌	Logo	应用领域
伯恩斯 - BOURNS		/
页数	文件大小	规格书
4页	347K
描述
RESISTOR, NETWORK, FILM, R-2R LADDER, 1W, SURFACE MOUNT, 1634, QSOP, ROHS COMPLIANT

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2QSP24-TF6-103/203LF 数据手册

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Thin Film on Silicon 2QSP / 2NBS -XX6 R2R Ladder

Mechanical Characteristics

QSOP Package Dimensions

Narrow-Body SOIC Package Dimensions

1.27

(.050)

.635

(.025)

TYP.

3.81 - 3.99

(.150 - .157)

.21 - .31

(.008 - .012)

0.36 - 0.46

(.014 - .018)

PIN 1

1.35 - 1.75

(.053 - .069)

1.35 - 1.75

(.053 - .069)

.10 - .25

(.004 - .010)

.10 - .25

(.004 - .010)

.19 - .25

(.007 - .010)

0-8 °

.19 - .25

(.007 - .010)

0-8 °

.41 - 1.27

(.016 - .050)

5.80 - 6.20

(.228 - .244)

.41 - 1.27

(.016 - .050)

5.80 - 6.20

(.228 - .244)

Model

2QSP16

2QSP20

2QSP24

2QSP28

Model

2NBS08

2NBS14

2NBS16

4.80 - 4.98 (.189 - .196)

8.56 - 8.74 (.337 - .344)

9.80 - 9.98 (.386 - .393)

4.80 - 4.98 (.189 - .196)

8.56 - 8.74 (.337 - .344)

9.80 - 9.98 (.386 - .393)

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

Governing dimensions are in mm. Dimensions in

parentheses are in inches and are approximate.

JEDEC Reference Number MS-012.

JEDEC Reference Number MO-137.

Specifications are subject to change without notice.

Customers should verify actual device performance in their specific applications.

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