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2920L330/24MR PDF预览

2920L330/24MR

更新时间: 2024-02-13 22:26:12
品牌 Logo 应用领域
力特 - LITTELFUSE 过载保护电阻器
页数 文件大小 规格书
6页 745K
描述
PTC RESET 24V 3.3A 2920 SMD

2920L330/24MR 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:,
Reach Compliance Code:unknown风险等级:1.55
其他特性:MINIMUM RESISTANCE IS 0.015 OHMSJESD-609代码:e3
安装特点:SURFACE MOUNT端子数量:2
最高工作温度:85 °C最低工作温度:-40 °C
封装形状:RECTANGULAR PACKAGE包装方法:TR, 7 INCH
电阻器类型:PTC RESETTABLE FUSE表面贴装:YES
端子面层:Matte Tin (Sn)端子位置:DUAL ENDED
端子形状:WRAPAROUND热敏电阻器应用:OVERLOAD PROTECTION
Base Number Matches:1

2920L330/24MR 数据手册

 浏览型号2920L330/24MR的Datasheet PDF文件第1页浏览型号2920L330/24MR的Datasheet PDF文件第2页浏览型号2920L330/24MR的Datasheet PDF文件第4页浏览型号2920L330/24MR的Datasheet PDF文件第5页浏览型号2920L330/24MR的Datasheet PDF文件第6页 
®
POLY-FUSE Resettable PTCs  
Surface Mount > 2920L Series  
Soldering Parameters  
Profile Feature  
Pb-Free Assembly  
t
P
T
P
Critical Zone  
to t  
Average Ramp-Up Rate (TS(max) to TP)  
Temperature Min (Ts(min)  
3°C/second max  
150°C  
t
L
P
Ramp-up  
)
T
L
S(max)  
t
L
Temperature Max (Ts(max)  
Time (Min to Max) (ts)  
Temperature (TL)  
)
Pre Heat:  
200°C  
T
Ramp-down  
60 – 180 secs  
217°C  
Preheat  
Time Maintained  
Above:  
T
S(min)  
t
Temperature (tL)  
S
60 – 150 seconds  
Peak / ClassificationTemperature (TP)  
260+0/-5 °C  
25  
time to peak temperature  
Time within 5°C of actual peak  
Temperature (tp)  
Time  
20 – 40 seconds  
Ramp-down Rate  
6°C/second max  
8 minutes Max.  
-- All temperature refer to topside of the package, measured on the package body surface  
-- If reflow temperature exceeds the recommended profile, devices may not meet the  
performance requirements  
Time 25°C to peakTemperature (TP)  
-- Recommended reflow methods: IR, vapor phase oven, hot air oven, N2 environment  
for lead  
-- Recommended maximum paste thickness is 0.25mm (0.010inch)  
-- Devices can be cleaned using standard industry methods and solvents  
-- Devices can be reworked using the standard industry practices  
Physical Specifications  
Environmental Specifications  
Solder-Plated Copper (Solder Material:  
MatteTin(Sn))  
Operating/Storage  
-40°C to +85°C  
Temperature  
Terminal Material  
Lead Solderability  
Maximum Device Surface  
Meets EIA Specification RS186-9E, ANSI/  
J-STD-002 Category 3.  
Temperature inTripped  
State  
125°C  
+85°C, 1000 hours  
-/+5% typical resistance change  
Passive Aging  
Additional Information  
+85°C, 85%,R.H.,1000 hours  
-/+5% typical resistance change  
Humidity Aging  
MIL-STD-20 2, Method 107  
+85°C/-40°C 20 times  
-30% typical resistance change  
Thermal Shock  
Solvent Resistance  
Vibration  
Saꢀꢁles  
ꢀatasꢁeet  
Resꢀꢁꢂꢃes  
MIL–STD–202, Method 215  
MIL–STD–883, Method 2007,  
Condition A  
Moisture Sensitivity Level Level 1, J–STD–020  
© 2017 Littelfuse, Inc.  
Specifications are subject to change without notice.  
Revised: 03/22/17  

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