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2920L30015 PDF预览

2920L30015

更新时间: 2022-04-23 23:00:11
品牌 Logo 应用领域
力特 - LITTELFUSE /
页数 文件大小 规格书
5页 379K
描述
POLYFUSE㈢ Resettable PTCs Surface Mount

2920L30015 数据手册

 浏览型号2920L30015的Datasheet PDF文件第1页浏览型号2920L30015的Datasheet PDF文件第2页浏览型号2920L30015的Datasheet PDF文件第4页浏览型号2920L30015的Datasheet PDF文件第5页 
POLYFUSE® Resettable PTCs  
Surface Mount  
Soldering Parameters  
Condition  
Reflow  
Peak Temp/ Duration Time  
Time above liquids (TAL) 220°C  
Preheat 120°C~ 180°C  
Storage Condition  
260°C / 10 Sec  
Soldering  
Cooling  
260  
220  
60 Sec ~ 100 Sec  
50 Sec ~ 150 Sec  
<
0°C~35°C, 70%RH  
=
Preheating  
180  
120  
• Recommended reflow methods: IR, vapor phase oven, hot air  
oven, N2 environment for lead-free  
• Devices are not designed to be wave soldered to the bottom side  
of the board.  
0
• Recommended maximum paste thickness is 0.25mm (0.010 inch)  
60 to 100  
120  
50 to 150  
• Devices can be cleaned using standard industry methods and  
solvents.  
Time(s)  
Note: If reflow temperatures exceed the recommended profile,  
devices may not meet the performance requirements.  
Physical Specifications  
Environmental Specifications  
Operating/Storage  
Solder-Plated Copper (Solder Material:  
Terminal Material  
-40°C to +85°C  
Matte Tin(Sn))  
Temperature  
Meets EIA Specification RS186-9E, ANSI/  
Lead Solderability  
Maximum Device Surface  
Temperature in Tripped State  
125°C  
J-STD-002 Category 3.  
+85°C, 1000 hours  
Passive Aging  
5% typical resistance change  
+85°C, 85%R.H. 1000 hours  
5% typical resistance change  
Humidity Aging  
MIL-STD-202 Method 107G  
+85°C/-40°C 20 times  
-30% typical resistance change  
Thermal Shock  
Solvent Resistance  
Vibration  
MIL-STD-202, Method 215  
MIL-STD-883C, Method  
2007.1, Condition A  
2920L Series  
www.littelfuse.com  
©2006 Littelfuse  
Electronics Designers Guide  
Specifications are subject to change without notice.  

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