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251748-007 PDF预览

251748-007

更新时间: 2022-09-15 18:24:21
品牌 Logo 应用领域
英特尔 - INTEL /
页数 文件大小 规格书
102页 3934K
描述
Intel Celeron Processor on 0.13 Micron Process in the 478-Pin Package

251748-007 数据手册

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Tables  
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2
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References..........................................................................................................11  
VCCVID Pin Voltage Requirements....................................................................15  
Voltage Identification Definition...........................................................................16  
System Bus Pin Groups......................................................................................19  
BSEL[1:0] Frequency Table for BCLK[1:0] .........................................................20  
Processor DC Absolute Maximum Ratings.........................................................21  
Voltage and Current Specifications.....................................................................22  
VCC Static and Transient Tolerance...................................................................23  
System Bus Differential BCLK Specifications .....................................................25  
AGTL+ Signal Group DC Specifications .............................................................25  
Asynchronous GTL+ Signal Group DC Specifications........................................26  
PWRGOOD and TAP Signal Group DC Specifications ......................................26  
ITPCLKOUT[1:0] DC Specifications....................................................................27  
BSEL [1:0] and VID[4:0] DC Specifications.........................................................27  
AGTL+ Bus Voltage Definitions...........................................................................28  
System Bus Differential Clock Specifications......................................................29  
System Bus Common Clock AC Specifications ..................................................29  
System Bus Source Synch AC Specifications AGTL+ Signal Group..................30  
Miscellaneous Signals AC Specifications ...........................................................31  
System Bus AC Specifications (Reset Conditions).............................................31  
TAP Signals AC Specifications ...........................................................................31  
ITPCLKOUT[1:0] AC Specifications....................................................................32  
BCLK Signal Quality Specifications ....................................................................41  
Ringback Specifications for AGTL+ and Asynchronous GTL+ Signals  
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Groups ................................................................................................................42  
Ringback Specifications for PWRGOOD Input and TAP Signal Group ..............43  
1.525V VID Source Synchronous (400 MHz) AGTL+ Signal Group  
25  
26  
Overshoot/Undershoot Tolerance.......................................................................47  
27  
28  
29  
1.525 V VID Source Synchronous (200 MHz) AGTL+ Signal Group  
Overshoot/Undershoot Tolerance.......................................................................48  
1.525 V VID Common Clock (100 MHz) AGTL+ Signal Group  
Overshoot/Undershoot Tolerance.......................................................................48  
1.525 V VID Asynchronous GTL+, PWRGOOD Input, and TAP Signal  
Group Overshoot/Undershoot Tolerance............................................................48  
Description Table for Processor Dimensions......................................................52  
Package Dynamic and Static Load Specifications..............................................54  
Processor Mass ..................................................................................................55  
Processor Material Properties.............................................................................55  
Pin Listing by Pin Name......................................................................................60  
Pin Listing by Pin Number...................................................................................66  
Signal Description ...............................................................................................72  
Processor Thermal Design Power ......................................................................83  
Power-On Configuration Option Pins..................................................................85  
Thermal Diode Parameters.................................................................................90  
Thermal Diode Interface......................................................................................90  
Fan Heatsink Power and Signal Specifications...................................................95  
Boxed Processor Fan Heatsink Set Points .........................................................99  
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Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package Datasheet  

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