Contents
1
Introduction..................................................................................................................9
1.1
Terminology...........................................................................................................9
1.1.1 Processor Packaging Terminology.........................................................10
References..........................................................................................................11
1.2
2
Electrical Specifications........................................................................................13
2.1
2.2
2.3
System Bus and GTLREF...................................................................................13
Power and Ground Pins ......................................................................................13
Decoupling Guidelines ........................................................................................13
2.3.1 VCC Decoupling.....................................................................................14
2.3.2 System Bus AGTL+ Decoupling.............................................................14
2.3.3 System Bus Clock (BCLK[1:0]) and Processor Clocking .......................14
Voltage Identification...........................................................................................15
2.4.1 Phase Lock Loop (PLL) Power and Filter...............................................16
Reserved, Unused Pins, and TESTHI[12:0]........................................................18
System Bus Signal Groups .................................................................................19
Asynchronous GTL+ Signals...............................................................................20
Test Access Port (TAP) Connection....................................................................20
System Bus Frequency Select Signals (BSEL[1:0])............................................20
Maximum Ratings................................................................................................21
Processor DC Specifications...............................................................................21
2.11.1 Flexible Motherboard Guidelines (FMB).................................................21
AGTL+ System Bus Specifications .....................................................................28
System Bus AC Specifications............................................................................29
Processor AC Timing Waveforms .......................................................................32
2.4
2.5
2.6
2.7
2.8
2.9
2.10
2.11
2.12
2.13
2.14
3
System Bus Signal Quality Specifications....................................................41
3.1
3.2
3.3
System Bus Clock (BCLK) Signal Quality Specifications....................................41
System Bus Signal Quality Specifications and Measurement Guidelines...........42
System Bus Signal Quality Specifications and Measurement Guidelines...........45
3.3.1 Overshoot/Undershoot Guidelines .........................................................45
3.3.2 Overshoot/Undershoot Magnitude .........................................................45
3.3.3 Overshoot/Undershoot Pulse Duration...................................................45
3.3.4 Activity Factor.........................................................................................46
3.3.5 Reading Overshoot/Undershoot Specification Tables............................46
3.3.6 Conformance Determination to Overshoot/Undershoot
Specifications .........................................................................................47
4
Package Mechanical Specifications.................................................................51
4.1
4.2
4.3
4.4
4.5
Package Load Specifications ..............................................................................54
Processor Insertion Specifications ......................................................................55
Processor Mass Specifications ...........................................................................55
Processor Materials.............................................................................................55
Processor Markings.............................................................................................55
Intel® Celeron® Processor on 0.13 Micron Process in the 478-Pin Package Datasheet
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