250R145T

更新时间： 2024-02-11 11:04:38

品牌	Logo	应用领域
力特 - LITTELFUSE		电阻器非线性电阻器过载保护
页数	文件大小	规格书
6页	383K
描述
POLYFUSE Resettable PTCs Radial Leaded

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技术参数
数据手册

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250R145T 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	RADIAL LEADED, HALOGEN FREE & ROHS COMPLIANT
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8533.40.80.70	风险等级：	0.51
其他特性：	3 TO 14 OHMS MEASURED AT 20 DEG CEL	JESD-609代码：	e3
安装特点：	THROUGH HOLE MOUNT	端子数量：	2
最高工作温度：	85 °C	最低工作温度：	-40 °C
封装形状：	RECTANGULAR PACKAGE	包装方法：	AMMO PACK
额定（AC）电压（URac）：	250 V	电阻：	3 Ω
电阻器类型：	PTC RESETTABLE FUSE	子类别：	Non-linear Resistors
表面贴装：	NO	端子面层：	Matte Tin (Sn)
端子位置：	RADIAL	端子形状：	WIRE
热敏电阻器应用：	OVERLOAD PROTECTION	Base Number Matches：	1

250R145T 数据手册

POLYFUSE^®Resettable PTCs

Radial Leaded

Soldering Parameters - Wave Soldering

Condition

Wave Soldering

Peak Temp/ Duration Time

260°C 5 Sec

Soldering

Cooling

260

220

220°C

2 Sec ~ 20 Sec

Preheat 140°C ~ 180°C

Storage Condition

180 Sec ~ 210 Sec

Preheating

0°C~35°C 70%RH

190

160

• Recommended soldering methods: heat element oven or

N₂environment for lead-free.

• Devices are designed to be wave soldered to the bottom

side of the board.

2 to 5

20-30

180 to 210

Time(s)

• Devices can be cleaned using standard industry methods

and solvents.

• This proﬁle can be used for lead-free device

Note: If soldering temperatures exceed the recommended

proﬁle, devices may not meet the performance

requirements.

Soldering Parameters - Solder Reﬂow

Condition

Reﬂow

Peak Temp/ Duration Time

260°C 5 Sec

30 Sec ~ 60 Sec

60 Sec ~ 90 Sec

Soldering

Cooling

260

220

220°C

Preheat 160°C ~ 190°C

Storage Condition

Preheating

0°C~35°C, 70%RH

190

160

• Recommended reﬂow methods: IR, vapor phase oven, hot

air oven, N₂environment for lead-free.

• Devices are not designed to be wave soldered to the

bottom side of the board.

30 to 60

120

60 to 90

Time(s)

• Devices can be cleaned using standard industry methods

and solvents.

Note: If reﬂow temperatures exceed the recommended

proﬁle, devices may not meet the performance

requirements.

Physical Speciﬁcations

Environmental Speciﬁcations

Operating/Storage

Lead Material

Tin-plated copper

-40°C to +85°C

Temperature

Soldering

Characteristics

Solderability per MIL-STD-202,

Method 208E

Maximum Device Surface

Temperature in Tripped State

125°C

Cured, ﬂame retardant epoxy polymer

meets UL94V-0 requirements.

Insulating Material

Device Labeling

Passive Aging

65°C/85°C, 1000 hours

+85°C, 85%R.H. 1000 hours

Marked with LF, voltage, current rating,

and date code.

Humidity Aging

MIL-STD-202F Method 107G

+125°C to -55°C 10 times

Thermal Shock

Solvent Resistance

MIL-STD-202, Method 215F

250R Series

ꢂ

www.littelfuse.com

Speciﬁcations are subject to change without notice.

Electronics Designers Guide

1 2 345 6

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