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23K640-I/SN PDF预览

23K640-I/SN

更新时间: 2024-02-27 08:56:00
品牌 Logo 应用领域
美国微芯 - MICROCHIP 静态存储器
页数 文件大小 规格书
26页 346K
描述
64K SPI Bus Low-Power Serial SRAM

23K640-I/SN 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active零件包装代码:SOIC
包装说明:TSSOP, TSSOP8,.25针数:8
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8542.32.00.51风险等级:1.12
最长访问时间:25 ns最大时钟频率 (fCLK):20 MHz
I/O 类型:SEPARATEJESD-30 代码:R-PDSO-G8
JESD-609代码:e3长度:4.4 mm
内存密度:65536 bit内存集成电路类型:STANDARD SRAM
内存宽度:8湿度敏感等级:1
功能数量:1端口数量:1, (3 LINE)
端子数量:8字数:8192 words
字数代码:8000工作模式:SYNCHRONOUS
最高工作温度:85 °C最低工作温度:-40 °C
组织:8KX8输出特性:3-STATE
封装主体材料:PLASTIC/EPOXY封装代码:TSSOP
封装等效代码:TSSOP8,.25封装形状:RECTANGULAR
封装形式:SMALL OUTLINE, THIN PROFILE, SHRINK PITCH并行/串行:SERIAL
峰值回流温度(摄氏度):260电源:3/3.3 V
认证状态:Not Qualified座面最大高度:1.2 mm
最大待机电流:0.000004 A最小待机电流:2.7 V
子类别:SRAMs最大压摆率:0.01 mA
最大供电电压 (Vsup):3.6 V最小供电电压 (Vsup):2.7 V
标称供电电压 (Vsup):3 V表面贴装:YES
技术:CMOS温度等级:INDUSTRIAL
端子面层:Matte Tin (Sn) - annealed端子形式:GULL WING
端子节距:0.65 mm端子位置:DUAL
处于峰值回流温度下的最长时间:40宽度:3 mm
Base Number Matches:1

23K640-I/SN 数据手册

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23A640/23K640  
1.0  
ELECTRICAL CHARACTERISTICS  
(†)  
Absolute Maximum Ratings  
VCC.............................................................................................................................................................................4.5V  
All inputs and outputs w.r.t. VSS ......................................................................................................... -0.3V to VCC +0.3V  
Storage temperature .................................................................................................................................-65°C to 150°C  
Ambient temperature under bias...............................................................................................................-40°C to 125°C  
ESD protection on all pins...........................................................................................................................................2kV  
NOTICE: Stresses above those listed under “Absolute Maximum Ratings” may cause permanent damage to the  
device. This is a stress rating only and functional operation of the device at those or any other conditions above those  
indicated in the operational listings of this specification is not implied. Exposure to maximum rating conditions for an  
extended period of time may affect device reliability.  
TABLE 1-1:  
DC CHARACTERISTICS  
Industrial (I):  
Automotive (E): TA = -40°C to +125°C  
TA = -40°C to +85°C  
DC CHARACTERISTICS  
Param.  
No.  
Sym.  
Characteristic  
Min.  
Typ(1)  
Max. Units  
Test Conditions  
D001  
D001  
D002  
VCC  
Supply voltage  
Supply voltage  
1.5  
2.7  
1.95  
3.6  
V
V
V
23A640 (I-Temp)  
VCC  
VIH  
23K640 (I, E-Temp)  
High-level input  
voltage  
.7 VCC  
VCC  
+0.3  
D003  
D004  
D005  
D006  
D007  
D008  
VIL  
Low-level input  
voltage  
-0.3  
0.2xVCC  
V
V
VOL  
Low-level output  
voltage  
0.2  
IOL = 1 mA  
VOH  
ILI  
High-level output  
voltage  
VCC -0.5  
V
IOH = -400 μA  
Input leakage  
current  
±0.5  
±0.5  
μA  
μA  
CS = VCC, VIN = VSS OR VCC  
CS = VCC, VOUT = VSS OR VCC  
ILO  
Output leakage  
current  
ICC Read  
3
6
10  
mA FCLK = 1 MHz; SO = O  
mA FCLK = 10 MHz; SO = O  
mA FCLK = 20 MHz; SO = O  
Operating current  
Standby current  
D009  
ICCS  
200  
500  
nA CS = VCC = 1.8V, Inputs tied to VCC  
or VSS  
μA CS = VCC = 3.6V, Inputs tied to VCC  
or VSS  
μA CS = VCC = 3.6V, Inputs tied to VCC  
or VSS @ 125°C  
1
4
5
10  
D010  
D011  
CINT  
VDR  
Input capacitance  
7
pF VCC = 0V, f = 1 MHz, Ta = 25°C  
(Note 1)  
RAM data retention  
voltage (2)  
1.2  
V
Note 1: This parameter is periodically sampled and not 100% tested. Typical measurements taken at room  
temperature (25°C).  
2: This is the limit to which VDD can be lowered without losing RAM data. This parameter is periodically  
sampled and not 100% tested.  
DS22126C-page 2  
© 2009 Microchip Technology Inc.  

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