Datasheet > 222215365109

222215365109

更新时间： 2022-09-15 01:53:13

品牌	Logo	应用领域
威世 - VISHAY		电容器
页数	文件大小	规格书
8页	250K
描述
Aluminum Capacitors SMD (Chip) Long Life Vertical

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222215365109 数据手册

153 CLV

Vishay BCcomponents

Aluminum Capacitors

SMD (Chip) Long Life Vertical

0.4

±0.2

Table 2

DIMENSIONS in millimeters AND MASS

W B

NOMINAL

CASE SIZE

L × W × H

CASE

CODE

MASS

(g)

L_max

W_max

H_max

∅D

B_max

4.0 × 4.0 × 5.3

5.0 × 5.0 × 5.3

6.3 × 6.3 × 5.3

8.0 × 8.0 × 6.5

8.0 × 8.0 × 10

10 × 10 × 10

10 × 10 × 12

10 × 10 × 14

0405

0505

0605

0807

0810

1010

1012

1014

4.5

5.5

4.5

5.5

4.0

5.0

0.8

1.1

1.2

1.0

1.4

2.0

2.3

3.1

4.7

4.5

2.0 ± 0.2

2.3 ± 0.2

2.7 ± 0.2

3.4 ± 0.2

3.0 ± 0.2

3.3 ± 0.2

3.9 ± 0.2

≈ 0.13

≈ 0.20

≈ 0.30

≈ 0.50

≈ 1.00

≈ 1.30

≈ 1.40

≈ 1.50

6.8

5.5

6.3

8.6

6.8

8.0

8.6

10.5

12.3

14.3

8.0

10.6

10.0

0.3

max.

Fig.2 Dimensional outline.

MOUNTING

The capacitors are designed for automatic placement on to

printed-circuit boards.

Optimum dimensions of soldering pads depend amongst

others on soldering method, mounting accuracy, print layout

and/or adjacent components.

For recommended soldering pad dimensions, refer to Fig.3

and Table 3.

Fig.3 Recommended soldering

pad dimensions.

SOLDERING

Soldering conditions are defined by the curve, temperature

versus time, where the temperature is that measured on the

soldering pad during processing.

AS A GENERAL PRINCIPLE, TEMPERATURE AND

DURATION SHALL BE THE MINIMUM NECESSARY

REQUIRED TO ENSURE GOOD SOLDERING

CONNECTIONS. HOWEVER, THE SPECIFIED MAXIMUM

CURVES SHOULD NEVER BE EXCEEDED.

For maximum conditions refer to Fig.4.

Any temperature versus time curve which does not exceed

the specified maximum curves may be applied.

Table 3

280

PAD

RECOMMENDED SOLDERING PAD

DIMENSIONS in millimeters

260

240

220

200

180

160

140

120

100

(

CASE CODE

0405

0505

0605

0807

0810

1010

1012

1014

2.6

3.0

3.5

4.0

3.5

4.0

4.3

1.6

2.5

1.0

1.4

1.9

2.1

3.0

4.0

100

150

200

250

t (s)

Fig.4 Maximum temperature load during infrared reflow

soldering measured on the soldering pad.

Document Number: 28302

Revision: 07-Nov-05

For technical questions contact: aluminumcaps1@vishay.com

www.vishay.com

1 234 5 6 7 8

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