MANUFACTURING TECHNOLOGIES
Laser Direct Structuring (LDS)
TE is a leading supplier of molded interconnect device
(MID) technology with more than 25 years mass production
experience. LDS is an exciting technology used to create MIDs.
TE has been a leader in early adoption of LDS manufacturing
process technology, giving us the experience to help get the
design solution correct with minimal effort. Our in-house
development and fully integrated manufacturing means we
can better control the process and timing from end-to-end and
can transition quickly from prototype to mass production –
helping delivering your product fast to increase your speed to
market.
LDS can save valuable space in your application by integrating
high frequency, mechanical and electrical functionality into
one component. Laser structuring enables 3-dimensional (3D)
design/routing capability, versus the limiting 2-dimensional (2D)
capability on a printed circuit board (PCB) or other common
substrates.
The use of LDS technology is not limited to antennas, and
also includes electro-mechanical, shielding, and other
components used in a wide variety of applications.
LDS technology also allows for improved antenna performance
because antennas can be placed in the design where they have
more room for better bandwidth and efficiency.
Key benefits
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Ability to selectively and repeatably plate 3
dimensionally
Applied cost savings
Fast time to market
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Space savings
Flexibility for pattern changes during
production
Ability to produce thin (0.15 mm) traces
Improved antenna performance
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Simple/fast/low cost tooling
Printed Electronics
TE has deep experience in various printed electronics technologies, covering ink technologies and printing techniques. Our ink
technology research includes custom ink formulation in conductive, magnetic, and other functional inks, in addition to access and
experience with various commercially available inks. Our printing capabilities can cover analog and digital printing techniques of
2D and 3D surfaces. TE’s process and product development focus areas include antennas, sensors, passive components, in-mold
electronics, electrodes & contacts, and medical devices.
Contact TE for more information.
DATA AND DEVICES /// STANDARD AND CUSTOM ANTENNAS FOR IOT
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