1N5391G THRU 1N5399G
GLASS PASSIVATED SILICON RECTIFIER
Reverse Voltage - 50 to 1000 Volts Forward Current - 1.5Amperes
FEATURES
DO-15
The plastic package carries Underwriters Laboratory
Flammability Classification 94V-0
Construction utilizes void-free
molded plastic technique
Low reverse leakage
High forward surge current capability
High temperature soldering guaranteed:
260 C/10 seconds,0.375”(9.5mm) lead length,
5 lbs. (2.3kg) tension
Glass passivated chip junction
MECHANICAL DATA
Case: JEDEC DO-15 molded plastic body
Terminals: Plated axial leads, solderable per MIL-STD-750,
Method 2026
Polarity: Color band denotes cathode end
Mounting Position: Any
Weight:0.014 ounce, 0.40 grams
Dimensions in inches and (millimeters)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS
Ratings at 25 C ambient temperature unless otherwise specified.
Single phase half-wave 60Hz,resistive or inductive load,for capacitive load current derate by 20%.
1N
1N
1N
1N
1N
1N
1N
1N
1N
SYMBOLS
UNITS
5391G 5392G 5393G 5394G 5395G 5396G 5397G 5398G 5399G
Maximum repetitive peak reverse voltage
Maximum RMS voltage
50
35
50
200 300 400 500 600 800 1000
140 210 280 350 420 560 700
200 300 400 500 600 800 1000
V
V
V
100
70
VRRM
VRMS
VDC
Maximum DC blocking voltage
100
Maximum average forward rectified current
0.375”(9.5mm) lead length at TA=75 C
Peak forward surge current
I(AV)
1.5
A
IFSM
50.0
1.1
8.3ms single half sine-wave superimposed on
rated load (JEDEC Method)
A
V
VF
IR
Maximum instantaneous forward voltage at 1.5A
Maximum DC reverse current
at rated DC blocking voltage
TA=25 C
5.0
50.0
µ
A
TA=100 C
Typical junction capacitance (NOTE 1)
CJ
RθJA
pF
C/W
C
20.0
50.0
Typical thermal resistance (NOTE 2)
Operating junction and storage temperature range
TJ,TSTG
-55 to +150
Note:1.Measured at 1MHz and applied reverse voltage of 4.0V D.C.
2.Thermal resistance from junction to ambient at 0.375”(9.5mm)lead length,P.C.B. mounted
DN:T07B05A0
STAR SEA