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1N3044AE3 PDF预览

1N3044AE3

更新时间: 2024-01-09 05:58:41
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美高森美 - MICROSEMI /
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1N3044AE3 数据手册

 浏览型号1N3044AE3的Datasheet PDF文件第2页浏览型号1N3044AE3的Datasheet PDF文件第3页 
1N3016B thru 1N3051B, e3  
1 WATT METAL CASE ZENER DIODES  
S C O T T S D A L E D I V I S I O N  
DESCRIPTION  
APPEARANCE  
This well established zener diode series for the 1N3016 thru 1N3051  
JEDEC registration in the metal case DO-13 package provides a glass  
hermetic seal for 6.8 to 200 volts. It is also well suited for high-reliability  
applications where it is available in JAN, JANTX, and JANTXV military  
qualifications. Lower voltages are also available in the 1N3821 thru  
1N3830 series (3.3 V to 7.5 V) in the same package (see separate data  
sheet). Microsemi also offers numerous other Zener diode products for a  
variety of other packages including surface mount.  
DO-13  
IMPORTANT: For the most current data, consult MICROSEMI’s website: http://www.microsemi.com  
FEATURES  
APPLICATIONS / BENEFITS  
Zener Voltage Range: 6.8V to 200V  
Hermetically sealed DO-13 metal package  
Internally solder-bonded construction.  
Regulates voltage over a broad operating current  
and temperature range  
Wide selection from 6.8 to 200 V  
Tight voltage tolerances available  
Low reverse (leakage) currents  
Nonsensitive to ESD  
Also available in JAN, JANTX, JANTXV qualifications  
per MIL-PRF19500/115 by adding the JAN, JANTX,  
or JANTXV prefixes to part numbers for desired level  
of screening, e.g. JANTX1N3016B,  
Hermetically sealed metal package  
JANTXV1N3051B, etc.  
Inherently radiation hard as described in  
Microsemi MicroNote 050  
Surface mount also available with 1N3016BUR-1 thru  
1N3051BUR-1 series on separate data sheet  
RoHS Compliant devices available by adding “e3” suffix  
MAXIMUM RATINGS  
MECHANICAL AND PACKAGING  
Operating Junction and Storage Temperatures:  
-65oC to +175oC  
THERMAL RESISTANCE: 50oC/W* junction to lead  
at 0.375 inches (10 mm) from body or 110 oC/W  
junction to ambient when leads are mounted on FR4  
PC board with 4 mm2 copper pads (1 oz) and track  
width 1 mm, length 25 mm  
DC Power Dissipation*: 1.0 Watt at TL < +125oC 3/8”  
(10 mm) from body or 1.0 Watts at TL < +65oC when  
mounted on FR4 PC board as described for thermal  
resistance above (also see Fig 1)  
CASE: DO-13 (DO-202AA), welded, hermetically  
sealed metal and glass  
FINISH: All external surfaces are Tin-Lead (Pb/Sn)  
or RoHS Compliant annealed matte-Tin (Sn) plating  
and solderable per MIL-STD-750 method 2026  
POLARITY: Cathode connected case.  
WEIGHT: 1.4 grams.  
Tape & Reel option: Standard per EIA-296 (add  
“TR” suffix to part number)  
See package dimensions on last page  
Forward Voltage @ 200 mA: 1.5 Volts.  
Solder Temperatures: 260 o C for 10 s (maximum)  
o
*
For further mounting reference options, thermal resistance from junction to metal case is < 20 C/W  
when mounting DO-13 metal case directly on heat sink.  
Copyright © 2006  
3-12-2006 REV B  
Microsemi  
Scottsdale Division  
Page 1  
8700 E. Thomas Rd. PO Box 1390, Scottsdale, AZ 85252 USA, (480) 941-6300, Fax: (480) 947-1503  

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