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1N5402G PDF预览

1N5402G

更新时间: 2024-01-12 04:20:26
品牌 Logo 应用领域
DEC 二极管
页数 文件大小 规格书
2页 390K
描述
3 AMP SOFT GLASS PASSIVATED SILICON DIODES

1N5402G 技术参数

是否无铅: 不含铅是否Rohs认证: 符合
生命周期:Active包装说明:O-PALF-W2
Reach Compliance Code:compliantECCN代码:EAR99
HTS代码:8541.10.00.80风险等级:5.05
应用:GENERAL PURPOSE外壳连接:ISOLATED
配置:SINGLE二极管元件材料:SILICON
二极管类型:RECTIFIER DIODEJEDEC-95代码:DO-201AD
JESD-30 代码:O-PALF-W2JESD-609代码:e3
最大非重复峰值正向电流:200 A元件数量:1
相数:1端子数量:2
最大输出电流:3 A封装主体材料:PLASTIC/EPOXY
封装形状:ROUND封装形式:LONG FORM
峰值回流温度(摄氏度):260认证状态:Not Qualified
最大重复峰值反向电压:200 V表面贴装:NO
端子面层:Matte Tin (Sn)端子形式:WIRE
端子位置:AXIAL处于峰值回流温度下的最长时间:10
Base Number Matches:1

1N5402G 数据手册

 浏览型号1N5402G的Datasheet PDF文件第2页 
DIOTEC ELECTRONICS CORP.  
18020 Hobart Blvd., Unit B  
Data Sheet No. GPPD-300-1B  
Gardena, CA 90248 U.S.A  
Tel.: (310) 767-1052 Fax: (310) 767-7958  
3 AMP SOFT GLASS PASSIVATED SILICON DIODES  
MECHANICAL SPECIFICATION  
FEATURES  
ACTUAL SIZE OF  
DO-27 PACKAGE  
SERIES 1N5400G - IN5408G  
R
PROPRIETARY SOFT GLASS JUNCTION  
PASSIVATION FOR SUPERIOR RELIABILITY AND  
PERFORMANCE  
DO - 27  
VOID FREE VACUUM DIE SOLDERING FOR MAXIMUM  
MECHANICAL STRENGTH AND HEAT DISSIPATION  
(Solder Voids: Typical < 2%, Max. < 10% of Die Area)  
LL  
BD (Dia)  
EXTREMELY LOW LEAKAGE AT HIGH TEMPERATURES  
LOW FORWARD VOLTAGE DROP  
BL  
Color Band  
Denotes  
3A at T = 75 C WITH NO THERMAL RUNAWAY  
Cathode  
MECHANICAL DATA  
LL  
LD (Dia)  
Minimum  
Maximum  
Sym  
In  
mm  
In  
mm  
9.28  
0.365  
0.205  
BL  
BD  
5.2  
1.00  
25.4  
LL  
LD  
1.3  
0.048  
1.2  
0.052  
MAXIMUM RATINGS & ELECTRICAL CHARACTERISTICS  
PARAMETER (TEST CONDITIONS)  
RATINGS  
SYMBOL  
UNITS  
H15  

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