Datasheet > 1812L270SL

1812L270SL

更新时间： 2024-02-04 08:10:33

品牌	Logo	应用领域
力特 - LITTELFUSE		/
页数	文件大小	规格书
7页	187K
描述
LoRhoTM Surface Mount Series

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1812L270SL 技术参数

生命周期：	Active	包装说明：	,
Reach Compliance Code：	unknown	风险等级：	5.62
其他特性：	MINIMUM RESISTANCE IS 0.003 OHMS	安装特点：	SURFACE MOUNT
端子数量：	2	最高工作温度：	85 °C
最低工作温度：	-40 °C	封装高度：	0.7 mm
封装长度：	4.73 mm	封装形式：	SMT
封装宽度：	3.41 mm	包装方法：	TR, 7 INCH
额定功率耗散 (P)：	1 W	参考标准：	CUL, TUV, UL
电阻器类型：	PTC RESETTABLE FUSE	表面贴装：	YES
端子位置：	DUAL ENDED	端子形状：	WRAPAROUND
热敏电阻器应用：	OVERCURRENT PROTECTION	工作电压：	6 V
Base Number Matches：	1

1812L270SL 数据手册

POLY-FUSE Resettable PTCs

Surface Mount > LoRho^TMSeries

Environmental Speciﬁcations

Temperature Rerating Curve

OperatingTemperature

-40°C to +85°C

125°C

170%

150%

130%

Maximum Device Surface

Temperature inTripped State

+85°C, 1000 hours

-/+10% typical resistance change

110%

90%

70%

Passive Aging

+85°C, 85% R.H.,100 hours

-/+15% typical resistance change

Humidity Aging

50%

30%

10%

MIL–STD–202, Method 107G

+85°C/-40°C 20 times

-30% typical resistance change

Thermal Shock

-40 -30 -20 -10

20 30

Temperature (°C)

40 50 60 70 80

MIL–STD–202, Method 215

No change

Solvent Resistance

MIL–STD–883C, Method 2007.1,

Condition A No change

Vibration

Physical Speciﬁcations

Moisture Sensitivity Level

Level 1, J–STD–020C

Solder-Plated Copper

Terminal Material

Lead Solderability

(Solder Material: MatteTin (Sn))

Meets EIA Speciﬁcation RS186-9E,

ANSI/J-STD-002, Category 3.

Soldering Parameters

Proﬁle Feature

Pb-Free Assembly

3°C/second max

Average Ramp-Up Rate (T_S(max)to T_P)

Temperature Min (T_s(min)

)

150°C

Temperature Max (T_s(max)

Time (Min to Max) (t_s)

Temperature (T_L)

)

Pre Heat:

200°C

60 – 180 secs

217°C

Time Maintained

Above:

Temperature (t_L)

60 – 150 seconds

260^+0/-5°C

Peak / ClassiﬁcationTemperature (T_P)

Time within 5°C of actual peak

Temperature (t_p)

20 – 40 seconds

Ramp-down Rate

6°C/second max

8 minutes Max.

-- All temperature refer to topside of the package, measured on the package body surface

Time 25°C to peakTemperature (T_P)

-- If reﬂow temperature exceeds the recommended proﬁle, devices may not meet the

performance requirements

-- Recommended reﬂow methods: IR, vapor phase oven, hot air oven, N₂environment for lead

-- Recommended maximum paste thickness is 0.25mm (0.010 inch)

-- Devices can be cleaned using standard industry methods and solvents

-- Devices can be reworked using the standard industry practices

Lo Rho Series

Speciﬁcations are subject to change without notice.

Please refer to www.littelfuse.com/series/LoRho.html for current information.

Revised: October 9, 2012

1 2 345 6 7

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