5秒后页面跳转
173-9-210P PDF预览

173-9-210P

更新时间: 2024-01-23 05:47:12
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
5页 262K
描述
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS

173-9-210P 数据手册

 浏览型号173-9-210P的Datasheet PDF文件第2页浏览型号173-9-210P的Datasheet PDF文件第3页浏览型号173-9-210P的Datasheet PDF文件第4页浏览型号173-9-210P的Datasheet PDF文件第5页 
WTS001_p50-68 6/14/07 10:46 AM Page 64  
Accessory  
Products  
THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS  
The 120 Series Silicone Oil-Based Thermal Joint Compound fills the minute air gap between mating surfaces with  
120 SERIES  
a grease-like material containing zinc oxide in a silicone oil carrier. It possesses an excellent thermal resistance of  
only 0.05°C/W for a 0.001 in. film with an area of one square inch. There is no measurable increase in case tem-  
perature of a mounted semiconductor on a heat sink after the 6-month stabilization period (Time versus Thermal  
Resistivity graph below).  
TYPICAL VALUES FOR THERMAL RESISTANCE,  
120 SERIES - THERMAL JOINT COMPOUND  
CASE TO SINK (Ø ) WHEN THERMAL JOINT  
cs  
Characteristic  
Volume Resistivity  
Description  
5 X 1014 ohm-cm  
225 volts/mil  
COMPOUNDS ARE USED  
Typical  
Mounting Torque Thermal  
in inch • pounds Resistance  
Dielectric Strength  
Case Style Characteristics  
T0-3  
TO-66  
(N•M)  
8 (0.9)  
9 (0.9)  
(°C/W)  
0.09  
0.14  
Specific Gravity  
Thermal Conductivity @ 36°C  
2.1 min.  
0.735 W/(m)(K)  
5.1(Btu) (in.)/(hr)(ft2)(°F)  
TO-220  
8 (0.9)  
15 (1.7)  
0.50  
0.16  
Thermal Resistivity (P)  
Bleed, % after 24 hrs @ 200°C  
Evaporation, % after 24 hrs @ 200°C  
Color  
56 (°C)(in.)/watt  
0.5  
0.19 (4.8) stud x 0.44 (11.2) hex  
0.25 (6.4) stud x 0.69 (17.5) hex  
0.38 (9.7) stud x 1.06 (26.9) hex  
30 (3.39)  
75 (8.47)  
0.10  
0.07  
0.5  
opaque white  
5 years  
0.50 (12.7) stud x 1.06 (26.9) hex  
0.75 (19.1) stud x 1.25 (31.8) hex  
125 (14.12)  
600 (67.79)  
0.07  
0.052  
Shelf life  
Operating Temperature Range (°C)  
-40/+200  
120 SERIES - ORDER GUIDE  
Series -  
P/N  
Container Size  
120-SA  
120-2  
120-5  
120-8  
120-80  
120-320  
4 gram plastic pak  
2 oz (0.06 kg) jar  
5 oz (0.14 kg) tube  
8 oz (0.23 kg) jar  
5 lb (2.27 kg) can  
20 lb (9.08 kg) can  
HIGH PERFORMANCE THERMAL COMPOUND  
122 Series Thermal Joint Compound is a stable, silicone based, thixotropic paste developed to provide premium  
performance at an affordable price. It is formulated to significantly reduce contact thermal resistance where  
power densities are concentrated in devices such as flip chip, reduced die size, and ‘overclock’ microprocessors.  
When applied as a thin film between a Wakefield heat sink and device it possesses superior thermal conductivity  
compared to traditional ‘grease’. It is compatible with automated or manual dispensing methods and is fully RoHS  
compliant.  
122 SERIES  
122 SERIES - ORDER GUIDE  
122 SERIES THERMAL JOINT COMPOUND  
Series -  
Container Size  
Typical Characteristics  
Description  
P/N  
122-10CC  
122-2  
10cc syringe  
2 oz (0.06 kg) jar  
30cc syringe  
Appearance  
Smooth Gray paste  
Thermal Conductivity  
2.5 W / m °K,  
17.3 (Btu) (in.)/(hr) (ft2) (0F)  
122-30CC  
Thermal Resistance  
Bleed  
0.02 °C in 2 / W  
0.015 wt%, 24 hrs at 200°C  
0.150 wt%, 24 hrs at 200°C  
1.4 x 1010 ohm-cm  
225 volts/mil  
Evaporation  
Volume Resistivity  
Dielectric Strength  
Specific Gravity  
Operating Range  
Shelf Life  
2.23 (gm/cc) at 25°C  
-40°C to 205°C  
5 years  
64  

与173-9-210P相关器件

型号 品牌 获取价格 描述 数据表
173-9-230P ETC

获取价格

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
173-9-240P ETC

获取价格

THERMAL COMPOUNDS, ADHESIVES AND INTERFACE MATERIALS
1739253 PHOENIX

获取价格

Barrier Strip Terminal Block,
1739295 PHOENIX

获取价格

TERM BLOCK PCB
1739305 PHOENIX

获取价格

Barrier Strip Terminal Block,
1739318 PHOENIX

获取价格

Strip Terminal Block,
1739321 PHOENIX

获取价格

Strip Terminal Block,
1739460 PHOENIX

获取价格

Strip Terminal Block,
1739473 PHOENIX

获取价格

Strip Terminal Block,
1739499 PHOENIX

获取价格

Strip Terminal Block,