VS-16TTS16SPbF High Voltage Series
Surface Mountable
Phase Control SCR, 16 A
Vishay Semiconductors
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER
SYMBOL
TJ, TStg
TS
TEST CONDITIONS
VALUES
- 40 to 125
240
UNITS
Maximum junction and storage
temperature range
°C
Soldering temperature
For 10 s (1.6 mm from case)
Maximum thermal resistance,
junction to case
RthJC
DC operation
PCB mount (1)
1.3
°C/W
Typical thermal resistance,
junction to ambient
RthJA
40
2
g
Approximate weight
0.07
oz.
Marking device
Case style D2PAK (SMD-220)
16TTS16S
Note
When mounted on 1" square (650 mm2) PCB of FR-4 or G-10 material 4 oz. (140 μm) copper 40 °C/W.
For recommended footprint and soldering techniques refer to application note #AN-994.
(1)
125
120
115
110
105
100
95
18
16
14
12
10
8
16TTS.. Series
(DC) = 1.3 °C/W
180°
120°
90°
60°
30°
R
thJC
Conduction Angle
RMS Limit
Conduction Angle
16TTS.. Series
6
30°
4
4
60°
90°
T
= 125°C
J
120°
180°
2
0
90
0
1
2
3
4
5
6
7
8
9 10 11
0
2
6
8
10
12
Average On-state Current (A)
Average On-state Current (A)
Fig. 1 - Current Rating Characteristics
Fig. 3 - On-State Power Loss Characteristics
125
120
115
110
105
100
95
25
DC
16TTS.. Series
180°
R
(DC) = 1.3°C/W
thJC
120°
90°
60°
30°
20
Conduction Period
15
RMS Limit
10
Conduction Period
30°
4
60°
5
0
16TTS.. Series
= 125°C
90°
120°
T
J
180°
DC
90
0
2
4
6
8
10 12 14 16 18
0
2
6
8
10 12 14 16
Average On-state Current (A)
Average On-state Current (A)
Fig. 2 - Current Rating Characteristics
Fig. 4 - On-State Power Loss Characteristics
Document Number: 94590
Revision: 16-Jul-10
For technical questions within your region, please contact one of the following:
DiodesAmericas@vishay.com, DiodesAsia@vishay.com, DiodesEurope@vishay.com
www.vishay.com
3