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16T06A-B PDF预览

16T06A-B

更新时间: 2022-09-11 08:26:13
品牌 Logo 应用领域
尼尔 - NELLSEMI 可控硅三端双向交流开关
页数 文件大小 规格书
7页 2598K
描述
TRIACs, 16A Snubberless, Logic Level and Standard

16T06A-B 数据手册

 浏览型号16T06A-B的Datasheet PDF文件第1页浏览型号16T06A-B的Datasheet PDF文件第2页浏览型号16T06A-B的Datasheet PDF文件第3页浏览型号16T06A-B的Datasheet PDF文件第4页浏览型号16T06A-B的Datasheet PDF文件第5页浏览型号16T06A-B的Datasheet PDF文件第7页 
RoHS  
RoHS  
16T Series  
SEMICONDUCTOR  
Fig7. Non-repetitive surge peak on-state  
current for a sinusoidal  
Fig.8 Relative variation of gate trigger current  
ITSM(A), I²t(A²S)  
IGT,IH,IL[Tj] / IGT,IH,IL[Tj = 25°C]  
3000  
2.5  
2.0  
Tj initial=25°C  
holding current and latching current versus junction  
dl/dt limitation:  
50A/µs  
temperature (typical values)  
IGT  
1000  
lTSM  
1.5  
1.0  
IH&IL  
0.5  
0.0  
pulse with width tp<10ms and  
corresponding value of l²t  
l²t  
Tj(°C)  
100  
0.01  
0.10  
1.00  
10.00  
-40  
-20  
0
20  
40  
60  
80  
100  
120 140  
tp(ms)  
Fig.9 Relative variation of critical rate of  
decrease of main current versus  
(dV/dt)c (typical values)  
Fig.10 Relative variation of critical rate of  
decrease of main current versus  
(dV/dt)c (typical values)  
(dI/dt)c [(dV/dt)c] / Specified (dI/dt)c  
(dI/dt)c [T s  
(dI/dt)c [T ] /  
pecified]  
j
j
2.0  
1.8  
1.6  
1.4  
1.2  
1.0  
6
5
4
3
2
1
0
snubberless and Logic level types  
standard types  
SW  
C
B
CW/BW  
0.8  
0.6  
Tj(°C)  
(dV/dt)c (V/µs)  
0.4  
1.0  
10.0  
100.0  
0
25  
50  
75  
100  
0.1  
125  
Fig.11 D²PAK thermal resistance junction to ambient versus  
copper surface under tab (printed circuit FR4, copper  
thickness: 35µm  
Rth(j-a)(°C/W)  
80  
70  
60  
50  
40  
D²PAK  
30  
20  
10  
0
S(cm²)  
0
4
8
12  
16  
20  
24  
28  
32  
36  
40  
www.nellsemi.com  
Page 6 of 7  

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