Product Brief
Marvell® FX-14™ Custom ASIC
Performance and power efficiency on silicon-proven technology
Overview
The FX-14 ASIC is a comprehensive semiconductor design
system targeted for wired and wireless networking, storage, and
cloud computing applications. FX-14 is designed to deliver more
performance per watt and use fewer watts per GHz in less space.
Compared to its predecessor*, it offers significant power and
area savings, including:
The FX-14 TCAM leverages more than 15 years of design
experience. Capable of billions of searches per second, the TCAM
is one of the fastest, densest and lowest power embedded
networking TCAMs in the industry. It utilizes proprietary
features for noise mitigation and offers up to 60% better
performance and 80% less leakage than its predecessor.*
• Up to 50% less active power
• Up to 85% less leakage
• Up to 55% less area
Highlights
Industry-leading 60G Long Reach SerDes for next generation
systems
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This combination of performance, power, and area advantages
can help chip designers stay ahead of system-level demands
driven by evolving network and data center architectures “and
the race to” 5G solutions. FX-14 takes advantage of a production-
proven, low-power 14nm FinFET platform from the GLOBAL
FOUNDRIES (GF) Fab 8 facility in Saratoga County, NY and years
of industry recognized expertise in bringing some of the
communications industry’s most sophisticated ASICs to life. You
can leverage this experience-along with advanced packaging, a
rich IP portfolio and an end-to-end, integrated and reliable
design methodology-to help you develop differentiated solutions
essential to your ongoing market leadership.
Industry’s densest TCAM for embedded networking
applications
High-density SRAM optimized for Machine Learning and
Network Applications
Ultra-low-voltage SRAM and Logic options for energy efficient
applications
Std. Cell Library for power and area efficient MAC
implementation in Machine Learning and Artificial
Intelligence applications
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Fully integrated Adaptive Voltage Scaling (AVS) ASIC flow
Future-Ready IP
Comprehensive portfolio of advanced packaging solutions,
including MCM, 2.5D Silicon Interposer and qualified 3D TSV
process*
The FX-14 IP portfolio features an array of Arm cores and
leading-edge high-speed SERDES (HSS), embedded TCAMs and
SRAMs. The FX-14 design library provides SoC design flexibility,
offering 64-bit Arm embedded processors along with a broad
range of 32-bit Arm cores and peripherals. The addition of the
64-bit cores enables designers to optimize their chips for
performance in the most demanding communications
applications.
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HBM integration with multireticle interposer qualified and in
production
An ultra-high-performance 56Gbps long-reach SerDes design
extends the GF HSS roadmap. PCI Express (PCIe), a high-
bandwidth memory (HBM) interface, and multiple 30Gbps
designs are also available. The GF HSS cores provide outstanding
jitter performance and qualization over a wide range of interface
standards.
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