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1221L-010 PDF预览

1221L-010

更新时间: 2022-12-14 18:07:28
品牌 Logo 应用领域
其他 - ETC /
页数 文件大小 规格书
7页 531K
描述
LOW NOISE ANALOG ACCELEROMETER

1221L-010 数据手册

 浏览型号1221L-010的Datasheet PDF文件第1页浏览型号1221L-010的Datasheet PDF文件第2页浏览型号1221L-010的Datasheet PDF文件第3页浏览型号1221L-010的Datasheet PDF文件第4页浏览型号1221L-010的Datasheet PDF文件第5页浏览型号1221L-010的Datasheet PDF文件第7页 
Model 1221 Low Noise Analog Accelerometer  
62/'(5,1*ꢀ5(&200(1'$7,216ꢁ  
Reflow using a hotplate is the preferred method for assembling the model 1221 surface mount accelerometer to your  
Printed circuit board. Sn62 or Sn63 type solder is recommended. Hand soldering using a fine tipped soldering iron is  
possible but difficult without a steady hand and some form of visual magnification due to the small size of the connections.  
When using the hand solder iron method, it’s best to purchase the J-Leaded version (1221J) for easier visual inspection  
of the finished solder joints.  
Pre-Tinning of Accelerometer Leads is Recommended: To prevent gold migration embrittlement of the solder joints,  
it is best to pre-tin the accelerometer leads. The solder bath method of pre-tinning is not recommended due to the high  
degree of heat the interior of the device gets subjected to which may cause permanent shifts in the bias and scale factor.  
Instead, we recommend tinning one lead at a time, to prevent excessive heating of the accelerometer, using a fine-tipped  
solder iron and solder wire.  
Hotplate Attach Method using Solder Paste or Solder Wire: Apply solder to the circuit board’s pads using Sn62 or Sn63  
solder paste or pre-tin the pads using solder and a fine tipped soldering iron. If pre-tinning with an iron, apply flux to the  
tinned pads prior to placing the components. Place the accelerometer in its proper position onto the pasted or tinned pads  
then place the entire assembly onto a hotplate that has been pre-heated to 200°C. Leave on hotplate only long enough  
for the solder to flow on all pads (DO NOT OVERHEAT!)  
Solder Iron Attach Method using Solder Paste: Apply solder paste to the circuit board’s pads where the accelerometer  
will be attached. Place the accelerometer in its proper position onto the pasted pads. Press gently on the top of the  
accelerometer with an appropriate tool to keep it from moving and heat one of the corner pads, then an opposite corner  
pad with the soldering iron. Make sure the accelerometer is positioned so all 20 of its connections are centered on the  
board’s pads. Once the two opposite corner pads are soldered, the part is secure to the board and you can work your way  
around soldering the remaining 18 connections. Allow the accelerometer to cool in between soldering each pin to prevent  
overheating.  
Solder Iron Attach Method using Solder Wire: Solder pre-tin two opposite corner pads on the circuit board where the  
accelerometer will be attached. Place the accelerometer in its proper position onto the board. Press gently on the top of  
the accelerometer and heat one of the corner pads that was tinned and the part will drop down through the solder and seat  
on the board. Do the same at the opposite corner pad that was tinned. Make sure the accelerometer is positioned so all  
20 of its connections are centered on the board’s pads. Once the two opposite corner pads are soldered, the part is secure  
to the board and you can work your way around soldering the remaining 18 connections. Allow the accelerometer to cool  
in between soldering each pin to prevent overheating.  
LCC & JLCC Solder Contact Plating Information: The plating composition and thickness for the solder pads and  
castellations on the “L” suffix (LCC) package are 100 to 225 micro-inches thick of gold (Au) over 80 to 350 micro-inches  
thick of nickel (Ni) over a minimum of 5 micro-inches thick of moly-manganese or tungsten refractory material. The leads  
for the “J” suffix (JLCC) package are made of CDA102 copper (Cu) have the same gold over nickel plating thicknesses  
as for the LCC pads.  
Recommended Solder Pad Pattern: The recommended solder pad size and shape for both the LCC and J-LCC  
packages is shown in the diagram and table below. These dimensions are recommendations only and may or may not  
be optimum for your particular soldering process.  
DIM  
A
inch  
.230  
.430  
.100  
.033  
.050  
.013  
.120  
mm  
5.84  
10.92  
2.54  
0.84  
1.27  
0.33  
3.05  
B
C
D
E
F
G
SPECIFICATIONS SUBJECT TO CHANGE WITHOUT NOTICE  
Silicon Designs, Inc. 1445 NW Mall Street, Issaquah, WA 98027-5344  
Phone: 425-391-8329  
Fax: 425-391-0446  
Aug 05  
web site: www.silicondesigns.com  
[page 6]  

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