1000W 10BJxx(C)A-AU Series
JieJie Microelectronics CO., Ltd.
SOLDERING PARAMETERS
Pb-Free assembly
Reflow Condition
(see figure at right)
-Temperature Min (Ts(min)
-Temperature Max(Ts(max)
-Time (Min to Max) (ts)
)
+150℃
Pre
)
+200℃
Heat
Reflow condition
tp
60-180 secs.
TP
Average ramp up rate (Liquidus Temp
(TL)to peak)
Critical Zone
Ramp-up
TL to TP
3℃/sec. Max
TL
tL
Ts(max) to TL - Ramp-up Rate
3℃/sec. Max
+217℃
TS(max)
Ramp-down
-Temperature(TL)(Liquidus)
Reflow
Preheat
TS(min)
ts
-Temperature(tL)
60-150 secs.
+260(+0/-5)℃
20-40secs.
6℃/sec. Max
8 min. Max
+260℃
25
Peak Temp (Tp)
time to peak temperatue
Time
(t 25℃ to peak)
Time within 5℃of actual Peak Temp (tp)
Ramp-down Rate
Time 25℃ to Peak Temp (TP)
Do not exceed
PACKAGE MECHANICAL DATA
B
Dimensions
Ref.
Millimeters
Inches
Min. Max.
Min.
Max.
3.94
4.80
2.20
1.52
5.60
A
B
C
D
E
F
G
H
J
3.30
4.30
1.90
0.95
5.20
0.130 0.155
0.169 0.189
0.075 0.087
0.037 0.060
0.205 0.220
D
E
G
0.051 0.203 0.002 0.008
0.15
2.10
2.20
0.31
2.40
0.006 0.012
0.083 0.094
0.087
J
J
K
K
L
2.60
0.102
2.30
0.091
DO-214AA (SMB)
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