是否无铅: | 含铅 | 是否Rohs认证: | 不符合 |
生命周期: | Active | 包装说明: | 1611 |
Reach Compliance Code: | compliant | ECCN代码: | EAR99 |
HTS代码: | 8504.50.80.00 | 风险等级: | 5.46 |
大小写代码: | 1611 | 构造: | Rectangular |
型芯材料: | IRON | 直流电阻: | 1.3 Ω |
标称电感 (L): | 1.8 µH | 电感器应用: | RF INDUCTOR |
电感器类型: | GENERAL PURPOSE INDUCTOR | JESD-609代码: | e4 |
功能数量: | 1 | 端子数量: | 2 |
最高工作温度: | 125 °C | 最低工作温度: | -55 °C |
封装高度: | 1.91 mm | 封装长度: | 3.94 mm |
封装形式: | SMT | 封装宽度: | 2.79 mm |
包装方法: | Bulk | 最小质量因数(标称电感时): | 38 |
最大额定电流: | 0.27 A | 自谐振频率: | 90 MHz |
形状/尺寸说明: | RECTANGULAR PACKAGE | 屏蔽: | NO |
表面贴装: | YES | 端子面层: | Gold (Au) |
端子位置: | DUAL ENDED | 端子形状: | ONE SURFACE |
容差: | 1% | Base Number Matches: | 1 |
型号 | 品牌 | 获取价格 | 描述 | 数据表 |
106-182H | API |
获取价格 |
General Purpose Inductor, 1.8uH, 3%, 1 Element, Iron-Core, SMD, 1611, CHIP | |
106-182J | API |
获取价格 |
General Purpose Inductor, 1.8uH, 5%, 1 Element, Iron-Core, SMD, 1611, CHIP | |
106-183F | API |
获取价格 |
General Purpose Inductor, 18uH, 1%, 1 Element, Iron-Core, SMD, 1611, CHIP | |
106-183G | API |
获取价格 |
General Purpose Inductor, 18uH, 2%, 1 Element, Iron-Core, SMD, 1611, CHIP | |
106-183H | API |
获取价格 |
General Purpose Inductor, 18uH, 3%, 1 Element, Iron-Core, SMD, 1611, CHIP | |
106-183J | API |
获取价格 |
General Purpose Inductor, 18uH, 5%, 1 Element, Iron-Core, SMD, 1611, CHIP | |
106185-0027 | MOLEX |
获取价格 |
MTP* Backplane Interconnect System (BMTP) | |
106186-0013 | MOLEX |
获取价格 |
MTP* Backplane Interconnect System (BMTP) | |
106186-0017 | MOLEX |
获取价格 |
MTP* Backplane Interconnect System (BMTP) | |
106186-0021 | MOLEX |
获取价格 |
MTP* Backplane Interconnect System (BMTP) |