Datasheet > 1048576

1048576

更新时间： 2022-09-10 17:38:21

品牌	Logo	应用领域
德州仪器 - TI		/
页数	文件大小	规格书
9页	134K
描述
32-BIT DYNAMIC RAM MODULE

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数据手册

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1048576 数据手册

TM124BBK32F, TM124BBK32U 1048576 BY 32-BIT DYNAMIC RAM MODULE

TM248CBK32F, TM248CBK32U 2097152 BY 32-BIT DYNAMIC RAM MODULE

SMMS649A – DECEMBER 1994 – REVISED JUNE 1995

timing requirements over recommended ranges of supply voltage and operating free-air

temperature (continued)

’124BBK32F-60 ’124BBK32F-70 ’124BBK32F-80

’248CBK32F-60 ’248CBK32F-70 ’248CBK32F-80

UNIT

MIN

MAX

MIN

MAX

MIN

MAX

Hold time, W low after CAS low

WCH

WRH

CHR

CRP

CSH

CSR

RAD

RAL

CAL

RCD

RPC

RSH

REF

Hold time, W high after RAS low (CBR refresh only)

Delay time, RAS low to CAS high (CBR refresh only)

Delay time, CAS high to RAS low

Delay time, RAS low to CAS high

Delay time, CAS low to RAS low (CBR refresh only)

Delay time, RAS low to column address (see Note 10)

Delay time, column address to RAS high

Delay time, column address to CAS high

Delay time, RAS low to CAS low (see Note 10)

Delay time, RAS high to CAS low (CBR only)

Delay time, CAS low to RAS high

Refresh time interval

Transition time

NOTE 10: The maximum value is specified only to assure access time.

device symbolization (TM124BBK32F illustrated)

TM124BBK32F

-SS

YYMMT

YY = Year Code

MM = Month Code

T = Assembly Site Code

-SS = Speed Code

NOTE: Location of symbolization may vary.

POST OFFICE BOX 655303 • DALLAS, TEXAS 75265

^{POST OFFICE BOX 1443}• HOUSTON, TEXAS 77251–1443

1...4 5 678 9

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