Absolute Maximum Ratings (Note 1)
ESD (Note 2)
≥2000V
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
Recommended Operating
Conditions
Case Temperature (TC)
Military
Above which the useful life may be impaired
Storage Temperature (TSTG
)
−65˚C to +150˚C
−55˚C to +125˚C
−5.7V to −4.2V
Maximum Junction Temperature (TJ)
Ceramic
Supply Voltage (VEE
)
+175˚C
−7.0V to +0.5V
VEE to +0.5V
−50 mA
Note 1: Absolute maximum ratings are those values beyond which the de-
vice may be damaged or have its useful life impaired. Functional operation
under these conditions is not implied.
VEE Pin Potential to Ground Pin
Input Voltage (DC)
Note 2: ESD testing conforms to MIL-STD-883, Method 3015.
Output Current (DC Output HIGH)
Military Version
DC Electrical Characteristics
=
=
=
=
VEE −4.2V to −5.7V, VCC VCCA GND, TC −55˚C to +125˚C
Symbol
Parameter
Min
Max
Units
TC
Conditions
Notes
=
VOH
Output HIGH Voltage
−1025
−870
mV
0˚C to
VIN VIH (Max)
Loading with
(Notes 3, 4, 5)
or VIL (Min)
50Ω to −2.0V
+125˚C
−55˚C
−1085
−870
mV
mV
VOL
Output LOW Voltage
Output HIGH Voltage
Output LOW Voltage
−1830 −1620
0˚C to
+125˚C
−55˚C
−1830 −1555
−1035
mV
mV
=
VOHC
0˚C to
VIN VIH (Min)
Loading with
(Notes 3, 4, 5)
or VIL (Max)
50Ω to −2.0V
+125˚C
−55˚C
−1085
−1610
mV
mV
VOLC
0˚C to
+125˚C
−55˚C
−1555
mV
mV
VIH
VIL
IIL
Input HIGH Voltage
Input LOW Voltage
Input LOW Current
−1165
−870
−55˚C to
+125˚C
−55˚C to
+125˚C
−55˚C to
+125˚C
Guaranteed HIGH Signal
for All Inputs
(Notes 3, 4, 5, 6)
(Notes 3, 4, 5, 6)
(Notes 3, 4, 5)
(Notes 3, 4, 5)
−1830 −1475
0.50
mV
µA
Guaranteed LOW Signal
for All Inputs
=
VEE −4.2V
=
VIN VIL (Min)
=
VEE −5.7V
IIH
Input HIGH Current
CP, MR
=
VIN VIH (Max)
350
240
500
340
µA
µA
0˚C to
+125˚C
−55˚C
D0–D5
CP, MR
D0–D5
IEE
Power Supply Current
−135
−50
mA
−55˚C to
+125˚C
Inputs Open
(Notes 3, 4, 5)
Note 3: F100K 300 Series cold temperature testing is performed by temperature soaking (to guarantee junction temperature equals −55˚C), then testing immediately
without allowing for the junction temperature to stabilize due to heat dissipation after power-up. This provides “cold start” specs which can be considered a worst case
condition at cold temperatures.
Note 4: Screen tested 100% on each device at −55˚C, +25˚C, and +125˚C, Subgroups 1, 2, 3, 7, and 8.
Note 5: Sample tested (Method 5005, Table I) on each manufactured lot at −55˚C, +25˚C, and +125˚C, Subgroups A1, 2, 3, 7, and 8.
Note 6: Guaranteed by applying specified input condition and testing V /V
.
OH OL
3
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