Datasheet > 08055C102K-MR

08055C102K-MR

更新时间： 2022-01-19 02:16:00

品牌	Logo	应用领域
其他 - ETC		过程控制系统 PCS
页数	文件大小	规格书
12页	326K
描述
CAP. 1NF MINIREEL 500PCS

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08055C102K-MR 数据手册

Surface Mounting Guide

MLC Chip Capacitors

WAVE SOLDERING

Case Size

0603

3.10 (0.12)

4.00 (0.15)

5.00 (0.19)

1.20 (0.05)

1.50 (0.06)

0.70 (0.03)

1.00 (0.04)

2.00 (0.09)

1.20 (0.05)

1.50 (0.06)

0.75 (0.03)

1.25 (0.05)

1.60 (0.06)

2.50 (0.10)

0805

1206

1210

Dimensions in millimeters (inches)

Component Spacing

Preheat & Soldering

For wave soldering components, must be spaced sufficiently

far apart to avoid bridging or shadowing (inability of solder

to penetrate properly into small spaces). This is less impor-

tant for reflow soldering but sufficient space must be

allowed to enable rework should it be required.

The rate of preheat should not exceed 4°C/second to

prevent thermal shock. A better maximum figure is about

2°C/second.

For capacitors size 1206 and below, with a maximum

thickness of 1.25mm, it is generally permissible to allow a

temperature differential from preheat to soldering of 150°C.

In all other cases this differential should not exceed 100°C.

For further specific application or process advice, please

consult AVX.

≥1.5mm (0.06)

≥1mm (0.04)

Cleaning

Care should be taken to ensure that the capacitors are

thoroughly cleaned of flux residues especially the space

beneath the capacitor. Such residues may otherwise

become conductive and effectively offer a low resistance

bypass to the capacitor.

≥1mm (0.04)

Ultrasonic cleaning is permissible, the recommended

conditions being 8 Watts/litre at 20-45 kHz, with a process

cycle of 2 minutes vapor rinse, 2 minutes immersion in the

ultrasonic solvent bath and finally 2 minutes vapor rinse.

1...4 5 678 9 10...12

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