Datasheet > 06123C224MAT4W

06123C224MAT4W

更新时间： 2024-02-08 06:21:29

阅读下载

获取价格

如果您发现信息不准确，欢迎纠错

06123C224MAT4W 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	包装说明：	, 0612
Reach Compliance Code：	compliant	ECCN代码：	EAR99
HTS代码：	8532.24.00.20	风险等级：	5.67
电容：	0.22 µF	电容器类型：	CERAMIC CAPACITOR
介电材料：	CERAMIC	高度：	1.02 mm
JESD-609代码：	e3	长度：	1.6 mm
安装特点：	SURFACE MOUNT	多层：	Yes
负容差：	20%	端子数量：	2
最高工作温度：	125 °C	最低工作温度：	-55 °C
封装形状：	RECTANGULAR PACKAGE	封装形式：	SMT
包装方法：	TR, EMBOSSED, 13 INCH	正容差：	20%
额定（直流）电压（URdc）：	25 V	尺寸代码：	0612
表面贴装：	YES	温度特性代码：	X7R
温度系数：	15% ppm/ °C	端子面层：	Matte Tin (Sn) - with Nickel (Ni) barrier
端子形状：	WRAPAROUND	宽度：	3.2 mm
Base Number Matches：	1

LGA Low Inductance Capacitors

0204/0306/0805 Land Grid Arrays

Land Grid Array (LGA) capacitors are the latest family of low inductance MLCCs from AVX.

These new LGA products are the third low inductance family developed by AVX. The in-

novative LGA technology sets a new standard for low inductance MLCC performance.

Electronic Products awarded its 2006 Product of the Year Award to the LGA Decoupling

capacitor.

Our initial 2 terminal versions of LGA technology deliver the performance of an 8 terminal

IDC low inductance MLCC with a number of advantages including:

• Simplified layout of 2 large solder pads compared to 8 small pads for IDCs

• Opportunity to reduce PCB or substrate contribution to system ESL by using multi-

ple parallel vias in solder pads

• Advanced FCT manufacturing process used to create uniformly flat terminations on

the capacitor that resist “tombstoning”

• Better solder joint reliability

APPLICATIONS

Semiconductor Packages

• Microprocessors/CPUs

• Graphics Processors/GPUs

• Chipsets

• FPGAs

• ASICs

Board Level Device Decoupling

• Frequencies of 300 MHz or more

• ICs drawing 15W or more

• Low voltages

• High speed buses

0306 2 TERMINAL LGA COMPARISON WITH 0306 8 TERMINAL IDC

0.1

0.01

0.001

100

1000

Frequency (MHz)

1 234

下载PDF