This document was generated on 11/04/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION
Part Number:
Status:
0473874781
Active
Description:
1.27mm (.050") Pitch Micro PGA Socket for Mobile Pentium* 4, Ball Grid Array (BGA)
Mount, with Pick and Place Cover, Black Socket, Purple Cover, Tray Packaging, Lead
Free
Documents:
3D Model
RoHS Certificate of Compliance (PDF)
Drawing (PDF)
Series image - Reference only
General
Product Family
Series
Comments
Component Type
Product Name
Processor Sockets
47387
ZIF,with Purple Pick and Place cover
Socket
EU RoHS
ELV and RoHS
Compliant
REACH SVHC
Not Reviewed
Halogen-Free
Status
Not Reviewed
Need more information on product
environmental compliance?
China RoHS
Micro PGA
Physical
Circuits (Loaded)
Circuits (maximum)
Color - Resin
478
478
Black
Natural
Color - Resin
Durability (mating cycles max)
Material - Metal
Material - Metal
Material - Plating Mating
Material - Plating Termination
Material - Resin
50
Email productcompliance@molex.com
Please visit the Contact Us section for any
non-product compliance questions.
Copper-Nickel-Silicon
Stainless Steel
Gold
Nickel
High Temperature Thermoplastic
Packaging Type
Tray
Search Parts in this Series
47387 Series
Pitch - Mating Interface (in)
Pitch - Mating Interface (mm)
Plating min: Mating (µin)
Plating min: Mating (µm)
Plating min: Termination (µm)
Temperature Range - Operating
Termination Interface: Style
0.050 In
1.27 mm
10.16
0.254
1.5
Mates With
Intel Mobile Celeron* Processor-M|Intel
Mobile Pentium* 4 Processor
-20°C to +90°C
Surface Mount
Electrical
Current - Maximum
Voltage - Maximum
0.5A
100V
Solder Process Data
Duration at Max. Process Temperature (seconds)
Lead-free Process Capability
10
Reflow Capable (SMT only)
Max. Cycles at Max. Process Temperature
Process Temperature max. C
1
250
Material Info
Reference - Drawing Numbers
Sales Drawing
SD-47387-001
* Pentium and Celeron are registered trademark of Intel Corporation
This document was generated on 11/04/2009
PLEASE CHECK WWW.MOLEX.COM FOR LATEST PART INFORMATION