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0453391605_18 PDF预览

0453391605_18

更新时间: 2022-10-12 14:25:17
品牌 Logo 应用领域
莫仕 - MOLEX /
页数 文件大小 规格书
26页 916K
描述
0.80mm Pitch HandyLink Plug for Wire Termination, 16 Circuit (with pin 15 voided)

0453391605_18 数据手册

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HANDYLINK™  
APPLICATION SPECIFICATION  
4.3  
Clearances Between Mated Parts  
The HandyLink connectors are designed such that the corresponding ‘front’ faces fully engage and then spring back 0.20mm to the  
final mated condition. This ‘over-travel clearance’ assures that the components of the passive latching system engage. Please see  
Section 6.4 Design Best Practices for further detailed information.  
5.0 SOLDERING PROCESS RECOMMENDATIONS  
5.144828 SMT Receptacle Connector  
5.1.1 PCB Layout  
See the applicable Sales Drawing for an illustration of the recommended PCB layout. Contact Molex if further assistance is required.  
5.1.2 Solder Paste Stencil Layout  
See Sales Drawing for solderable surfaces. Contact Molex if further assistance is required.  
5.1.3 Reflow Profile  
While the production solder reflow profile is typically established by the customer, based on their specific application, generic reflow  
profiles can be found in Product Specification PS-44828-001. The profiles are provided for reference purposes only.  
5.1.4 Inspection  
Solder joints should be inspected using established conventional methods.  
5.2 45560 SMT Cradle Connector  
5.2.1 PCB Layout  
See the applicable Sales Drawings for illustrations of the recommended PCB pad layouts. Contact Molex if further assistance is  
required.  
5.2.2 Solder Paste Stencil Layout  
See Sales Drawing for recommended PCB pad layout and solder paste thickness.  
REVISION:  
ECR/ECN INFORMATION:  
TITLE:  
SHEET No.  
APPLICATION SPECIFICATION  
HANDYLINK™I/O CONNECTOR SYSTEM  
EC No:  
UCP2006- 1391  
2005/12/13  
7 of 26  
A
DATE:  
DOCUMENT NUMBER:  
CREATED / REVISED BY:  
M. Simmel  
CHECKED BY:  
APPROVED BY:  
Marc Simmel  
Joe Comerci  
SD-45339-001  
TEMPLATE FILENAME: PRODUCT_SPEC[SIZE_A](V.1).DOC  

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