MICROWAVE CAPS
项目
Item
技术规格
Technical Specification
测 试 方 法
Test Method and Remarks
测试电压:额定电压
测试时间: 60±5 秒
测试湿度:≤75%
绝缘电阻
测试温度: 25℃±3℃
测试充放电电流:≤50mA
(IR)
≥10,000MΩ
Insulation
Resistance
Measuring Voltage: Rated Voltage(Max 500V)
Duration: 60±5s
Test Humidity: ≤75%
Test Temperature: 25℃±3℃
Test Current: ≤50mA
测量电压:Ⅰ类:300%额定电压
介质耐电强
时间: 1~5 秒
充/放电电流:不应超过 50mA
度(DWV)
不应有介质被击穿或损伤
No breakdown or damage.
Measuring Voltage:
ClassⅠ:300% Rated voltage
Dielectric
Withstanding
Voltage
Duration: 1~5s
Charge/ Discharge Current: 50mA max.
将电容在 80~120℃的温度下预热 10~30 秒.
Preheating conditions:80 to 120 ℃; 10~30s.
上锡率应大于 95%
外观:无可见损伤.
有铅焊料:(Sn/Pb:63/37)
无铅焊料:
可焊性
At least 95% of the terminal electrode is covered by 浸锡温度: 235±5℃
浸锡温度: 245±5℃
浸锡时间: 2±0.5s
Solder Temperature:
245±5℃
Solderability
new solder.
浸锡时间: 2±0.5s
Solder Temperature:
235±5℃
Visual Appearance: No visible damage.
Duration: 2±0.5s
Duration: 2±0.5s
在±0.5%或±0.5pF 范围内,取较大值
将电容在 100~200℃的温度下预热 10±2 分钟.
浸锡温度: 265±5℃
ΔC/C
Within ±0.5% or ±0.5pF,whichever is
larger
浸锡时间: 10±1s
然后取出溶剂清洗干净,在 10 倍以上的显微镜底下观察.
放置时间:24±2 小时 放置条件:室温
Preheating conditions: 100 to 200℃; 10±2min.
同初始标准
Q
耐焊接热
Same to initial value.
Resistance
to Soldering
Heat
Solder Temperature: 265 ±5℃
Duration: 10±1s
同初始标准
Same to initial value.
IR
Clean the capacitor with solvent and examine it with
10X(min.) microscope.
Recovery Time: 24±2h
Recovery condition: Room temperature
a
外观:无可见损伤 上锡率:≥95%
Appearance:No visible damage.At least 95% of the
terminal electrode is covered by new solder.
试验基板:Al2O3 或 PCB
施压速度:1mm/sec.
弯曲深度:1mm
单位:mm
应在弯曲状态下进行测量。
外观:无可见损伤.
Appearance: No visible damage.
Test Board: Al2O3 or PCB
Speed: 1mm/sec.
Warp: 1mm
Unit: mm
抗弯曲强度
The measurement should be made with the board in the
bending position.
Resistance
to Flexure of
Substrate
(Bending
Strength)
在±0.5%或±0.5pF 范围内,取较大值
ΔC/C
Within ±0.5% or ±0.5pF , whichever is
larger
端头结合强度
Termination
Adhesion
外观无可见损伤
No visible damage.
施加的力:5N
Applied Force: 5N
时间:10±1S
Duration: 10±1S