Product specification
10
12
SERIES
102 to 358
YC/TC
Chip Resistor Surface Mount
TESTS AND REQUIREMENTS
Table 4 Test condition, procedure and requirements
TEST
TEST METHOD
MIL-STD-202-method 108
IEC 60115-1 4.25.1
JIS C 5202-7.10
PROCEDURE
REQUIREMENTS
Life/
Operational Life/
Endurance
1,000 hours at 70±5 °C applied RCWV
1.5 hours on, 0.5 hour off, still air required
±(2%+0.05 Ω)
<100 mΩ for Jumper
High Temperature
Exposure/
Endurance at
Upper Category
Temperature
MIL-STD-202-method 108
IEC 60115-1 4.25.3
JIS C 5202-7.11
1,000 hours at maximum operating
temperature depending on specification,
unpowered
± (1%+0.05 Ω)
<50 mΩ for Jumper
No direct impingement of forced air to the
parts
Tolerances: 125±3 °C
Moisture
Resistance
MIL-STD-202-method 106
IEC 60115-1 4.24.2
Each temperature / humidity cycle is defined at ± (2%+0.05 Ω)
8 hours (method 106F), 3 cycles / 24 hours for
<100 mΩ for Jumper
10d with 25 °C / 65 °C 95% R.H, without
steps 7a & 7b, unpowered
Parts mounted on test-boards, without
condensation on parts
Measurement at 24±2 hours after
test conclusion
Thermal Shock
MIL-STD-202-method 107
-55/+125 °C
± (1%+0.05 Ω)
Note: Number of cycles required is 300.
Devices mounted
<50 mΩ for Jumper
Maximum transfer time is 20 seconds. Dwell
time is 15 minutes. Air – Air
Short Time
Overload
MIL-R-55342-para 4.7.5
IEC60115-1 4.13
2.5 times RCWV or maximum overload
voltage whichever is less for 5 sec at room
temperature
± (2%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
Board Flex/
Bending
IEC60115-1 4.33
Device mounted on PCB test board as
described, only 1 board bending required
± (1%+0.05 Ω)
<50 mΩ for Jumper
No visible damage
3 mm bending
Bending time: 60±5 seconds
Ohmic value checked during bending
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Feb. 21, 2019 V.9