Datasheet > X006

X006

更新时间： 2022-04-23 23:00:11

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		可控硅栅
页数	文件大小	规格书
9页	109K
描述
0.8 A sensitive gate SCRs

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X006 数据手册

X006

Characteristics

Table 3.

Symbol

Thermal resistances

Parameter

Value

Unit

TO-92

150

R_th(j-a)

Junction to ambient (DC)

S = 5 cm²

SOT-223

TO-92

°C/W

R_th(j-l)

R_th(j-t)

Junction to lead (DC)

Junction to tab (DC)

SOT-223

Figure 1.

Maximum average power

dissipation versus average on-state

current

Figure 2.

Average and DC on-state current

versus case temperature (TO-92)

P(W)

I (A)

T(AV)

0.6

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

α = 180°

TO-92

D.C.

0.5

0.4

0.3

0.2

0.1

α = 180°

360°

T (°C)

(A)

T(AV)

0.0

100

125

0.1

0.2

0.3

0.4

0.5

0.6

Figure 3.

Average and D.C. on-state current Figure 4.

versus ambient temperature (epoxy

printed circuit board FR4, copper

thickness = 35 µm, S_CU= 0.5 cm²)

(TO-92)

Average and DC on-state current

versus case temperature (SOT-223)

(A)

I (A)

T(AV)

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

1.0

0.9

0.8

0.7

0.6

0.5

0.4

0.3

0.2

0.1

0.0

SOT-223

TO-92

S_CU= 0.5 cm²

D.C.

α = 180°

T (°C)

tab

T (°C)

amb

100

125

100

125

3/9

1 234 5 6 7...9

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