Approval sheet
TEST AND REQUIREMENTS (AEC Q200)
TEST
PROCEDURE
Test 1000 hrs./ @T=125℃/ Un-powered.
REQUIREMENT
High temperature exposure
△ R/R max. ±(1%+0.5mΩ)
MIL-STD-202 Method 108 Measurement at 24±2 hours after test conclusion.
no visible damage
Temperature Cycling
Test 1000 cycles (-55℃ to +125℃).
△ R/R max. ±(0.5%+0.5mΩ)
JESD22 Method JA-104
Measurement at 24±2 hours after test conclusion
no visible damage
Moisture Resistance
Test 65℃/ 80~100%RH/ 10Cycles (t=24hrs/cycle).
△ R/R max. ±(0.5%+0.5mΩ)
MIL-STD-202 Method 106 Measurement at 24±2 hours after test conclusion.
no visible damage
Biased Humidity
MIL-STD-202 Method 103 Measurement at 24±2 hours after test conclusion.
Test 1000 hours/ @85℃/85% RH./ 10% of operation power.
△ R/R max. ±(1%+0.5mΩ)
no visible damage
Operational Life
MIL-STD-202 Method 108 Measurement at 24±2 hours after test conclusion
Test 1000 hrs./ TA=125℃ / 35% of operating power.
△ R/R max. ±(1%+0.5mΩ)
no visible damage
External Visual
MIL-STD-883 Method 2009 workmanship
Electrical test not required. Inspect device construction, marking and
No visual damage and refer
WTC marking code.
Physical Dimensions
JESD22 Method JB-100
The chip dimension (L, W, T, D) prescribed in the detail specification
shall be checked
Within the specified tolerance
Within product specification
tolerance and no visible
damage
Mechanical Shock
MIL-STD-202 Method 213 Velocity:12.3ft/sec.
Test Peak value:100g's / Wave:Hail-sine / Duration:6ms /
Vibration
MIL-STD-202 Method 204
△R/R max. ±(0.5%+0.5mΩ)
no visible damage
Test 5g’s for 20min., 12 cycles each of 3 orientations.
Resistance to Soldering
Heat
MIL-STD-202 Method 210
△ R/R max. ±(0.5%+0.5mΩ)
no visible damage
Solder dipping @ 270℃±5℃ for 10±1sec.
Thermal Shock
Test -55 to 155℃/ dwell time 15min/ Max transfer time 20sec/
△ R/R max. ±(0.5%+0.5mΩ)
MIL-STD-202 Method 107 300cycles.
no visible damage
ESD
AEC-Q200-002
△ R/R max. ±(1%+0.5mΩ)
no visible damage
Test contact 1KV(min)
a) Bake for 155℃ dwell time 4hrs/ solder dipping 235℃/ 5sec.
b) Steam the sample dwell time 8 hour/ solder dipping 215℃/ 5sec.
Solderability
good tinning (>95% covered)
no visible damage
J-STD-002
c) Steam the sample dwell time 8 hour/ solder dipping 260℃/ 7sec.
Natural resistance change per change in degree centigrade.
Temperature Coefficient of
Resistance(T.C.R)
Refer to
“QUICK REFERENCE DATA”
R2 R
106 (ppm/C) t1 : 20°C+5°C-1°C
1
Clause 4.8
R
1t2 t1
R1 : Resistance at reference temperature
R2 : Resistance at test temperature
Bending 2mm (Min).
Board flex
△ R/R max. ±(0.5%+0.5mΩ)
AEC-Q200-005
Termination strength
AEC-Q200-006
no visible damage
Force: 1.8kg for 60sec.
No cracking or no part being
sheared off from its pad.
Page 6 of 7
ASC_WW20N_J_AUTO_V01
MAR 2017