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WS128K32L-55G2UMA PDF预览

WS128K32L-55G2UMA

更新时间: 2024-01-29 09:37:12
品牌 Logo 应用领域
美高森美 - MICROSEMI 静态存储器内存集成电路
页数 文件大小 规格书
9页 1203K
描述
Standard SRAM, 128KX32, 55ns, CMOS, CQFP68, QFP-68

WS128K32L-55G2UMA 技术参数

生命周期:Active包装说明:QFP, QFP68,.99SQ,50
Reach Compliance Code:compliant风险等级:5
最长访问时间:55 ns其他特性:USER CONFIGURABLE AS 512K X 8
备用内存宽度:16I/O 类型:COMMON
JESD-30 代码:S-CQFP-G68长度:22.36 mm
内存密度:4194304 bit内存集成电路类型:STANDARD SRAM
内存宽度:32功能数量:1
端子数量:68字数:131072 words
字数代码:128000工作模式:ASYNCHRONOUS
最高工作温度:125 °C最低工作温度:-55 °C
组织:128KX32输出特性:3-STATE
封装主体材料:CERAMIC, METAL-SEALED COFIRED封装代码:QFP
封装等效代码:QFP68,.99SQ,50封装形状:SQUARE
封装形式:FLATPACK并行/串行:PARALLEL
电源:5 V认证状态:Not Qualified
座面最大高度:3.51 mm最大待机电流:0.002 A
最小待机电流:2 V子类别:SRAMs
最大压摆率:0.6 mA最大供电电压 (Vsup):5.5 V
最小供电电压 (Vsup):4.5 V标称供电电压 (Vsup):5 V
表面贴装:YES技术:CMOS
温度等级:MILITARY端子形式:GULL WING
端子节距:1.27 mm端子位置:QUAD
宽度:22.36 mmBase Number Matches:1

WS128K32L-55G2UMA 数据手册

 浏览型号WS128K32L-55G2UMA的Datasheet PDF文件第2页浏览型号WS128K32L-55G2UMA的Datasheet PDF文件第3页浏览型号WS128K32L-55G2UMA的Datasheet PDF文件第4页浏览型号WS128K32L-55G2UMA的Datasheet PDF文件第5页浏览型号WS128K32L-55G2UMA的Datasheet PDF文件第6页浏览型号WS128K32L-55G2UMA的Datasheet PDF文件第7页 
WS128K32-XXX  
128Kx32 SRAM MODULE, SMD 5962-93187 & 5962-95595  
FEATURES  
 Access Times of 15, 17, 20, 25, 35, 45, 55ns  
 MIL-STD-883 Compliant Devices Available  
 Packaging  
 Low Power CMOS  
 TTL Compatible Inputs and Outputs  
 Built in Decoupling Caps and Multiple Ground Pins for Low  
Noise Operation  
• 66 pin, PGA Type, 1.075" square, Hermetic Ceramic HIP  
(Package 400)  
 Weight:  
WS128K32-XG2UX - 8 grams typical  
WS128K32-XG2LX - 8 grams typical  
WS128K32-XH1X - 13 grams typical  
WS128K32-XG4TX1 - 20 grams typical  
• 68 lead, 40mm CQFP (G4T)1, 3.56mm (0.140") (Package  
502)  
• 68 lead, 22.4mm CQFP (G2U), 3.56mm (0.140"),  
(Package 510)  
 Devices are upgradeable to 512Kx32  
• 68 lead, 22.4mm (0.880") square, CQFP (G2L), 5.08mm  
(0.200") high, (Package 528)  
 Organized as 128Kx32; User Congurable as 256Kx16 or  
This product is subject to change without notice.  
512Kx8  
 Commercial, Industrial and Military Temperature Ranges  
 5 Volt Power Supply  
FIGURE 1 – PIN CONFIGURATION FOR WS128K32N-XH1X  
Top View  
Pin Description  
1
12  
23  
34  
45  
56  
I/O0-31  
A0-16  
Data Inputs/Outputs  
Address Inputs  
Write Enables  
Chip Selects  
I/O8  
I/O9  
I/O10  
A13  
WE2#  
CS2#  
GND  
I/O11  
A10  
I/O15  
I/O24  
I/O25  
I/O26  
A6  
VCC  
CS4#  
WE4#  
I/O27  
A3  
I/O31  
I/O30  
I/O29  
I/O28  
A0  
WE1-4  
#
CS1-4  
OE#  
VCC  
#
I/O14  
I/O13  
I/O12  
OE#  
NC  
Output Enable  
Power Supply  
Ground  
GND  
NC  
Not Connected  
A14  
A7  
Block Diagram  
A15  
A11  
NC  
A4  
A1  
WE#1 CS#1  
WE#2 CS#2  
WE#3 CS#3  
WE#4 CS#4  
128K x 8  
A16  
A12  
WE1#  
I/O7  
A8  
A5  
A2  
OE#  
A0-16  
NC  
VCC  
A9  
WE3#  
CS3#  
GND  
I/O19  
I/O23  
I/O22  
I/O21  
I/O20  
128K x 8  
128K x 8  
128K x 8  
I/O0  
I/O1  
I/O2  
CS1#  
NC  
I/O6  
I/O16  
I/O17  
I/O18  
I/O5  
8
8
8
8
I/O3  
I/O4  
I/O 0-7  
I/O 8-15  
I/O 16-23  
I/O 24-31  
11  
22  
33  
44  
55  
66  
Microsemi Corporation reserves the right to change products or specications without notice.  
September 2010 © 2010 Microsemi Corporation. All rights reserved.  
Rev. 18  
1
Microsemi Corporation • (602) 437-1520 • www.microsemi.com  

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