Datasheet > WIP252010P-R33ML

WIP252010P-R33ML

更新时间： 2024-03-18 20:21:49

品牌	Logo	应用领域
华新科技 - WALSIN		/
页数	文件大小	规格书
8页	652K
描述
SMD Molded Power Choke / WIP Series 0.33, 4.4A

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WIP252010P-R33ML 数据手册

Taping specifications

There shall be the portion having no product in both the head and the end of taping, and there shall be

the cover tape in the head of taping.

Label Marking

The label specified as follows shall be put on the side of reel.

(1) Part No

(2) Quantity

(3) Lot No

* Part No. And Quantity shall be marked on outer packaging.

Quantity of products in the taping package

(1)Standard quantity：3000pcs/Reel

(2)Shipping quantity is a multiple of standard quantity.

Precautions for Handling

Precaution for handling of substrate

Do not exceed to bend the board after soldering this product extremely. (reference examples)

• Mounting place must be as far as possible from the position, which is close to the break line of

board, or on the line of large holes of board.

• Do not bend extremely the board, in mounting another components.

If necessary, use back-up pin (support pin) to prevent from bending extremely.

• Do not break the board by hand. We recommend to use the machine or the jig to break it.

Precaution for soldering

Note that this product will be easily damaged by rapid heating, rapid cooling or local heating.

Do not give heat shock over 100°C in the process of soldering. We recommend to take preheating and

gradual cooling.

Recommendable reflow soldering

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ASC_WLPH252010_P Series

2019.03

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