TM
1
V•I Chip – VTM
Voltage Transformation Module
V048K015T80
Vf = 32 - 57.6 V
VOUT = 1.0 - 1.8 V
IOUT = 80 A
• 48V to 1.5V V•I Chip Converter
• 80 A (120 A for 1 ms)
• High density – up to 320 A/in3
• Small footprint – 80 A/in2
• Low weight – 0.4 oz (12 g)
• Pick & Place / SMD
• >92% efficiency at 1.5V
• 125°C operation
K = 1/32
ROUT = 1.5 mΩ max
©
• 1 µs transient response
• >3.5 million hours MTBF
• No output filtering required
• V•I ChipBGA package
Actual size
Product Description
Absolute Maximum Ratings
•
The V048K015T80 V I Chip Voltage Transformation
Parameter
Values
Unit
Notes
Module (VTM) breaks records for speed, density and
efficiency to meet the demands of advanced DSP,
FPGA, ASIC, processor cores and microprocessor
applications at the point of load (POL) while providing
isolation from input to output. It achieves a response
time of less than 1 µs and delivers up to 80A in a
volume of less than 0.25 in3 while converting 48 V to
1.5 V with unprecedented efficiency. It may be
paralleled to deliver hundreds of amps at an output
voltage settable from 1.0 to 1.8 Vdc.
+In to -In
-1.0 to 60.0
100
Vdc
Vdc
Vdc
Vdc
mA
Vdc
Vdc
°C
+In to -In
For 100 ms
PC to -In
-0.3 to 7.0
-0.3 to 7.0
500
TM to -In
SG to -In
+Out to -Out
-0.5 to 5.0
1500
Isolation voltage
Operating junction temperature
Output current
Input to Output
See note 2
Continuous
For 1 ms
-40 to 125
80
The VTM V048K015T80’s nominal output voltage is
1.5 Vdc from a 48 Vdc input factorized bus, Vf, and is
controllable from 1.0 to 1.8 Vdc at no load, and from
0.9 V to 1.7 V at full load, over a Vf input range of 32 to
57.6 Vdc. It can be operated either open- or closed-loop
depending on the output regulation needs of the
application. Operating open-loop, the output voltage
tracks its Vf input voltage with a transformation ratio,
K=1/32, and an output resistance, ROUT =1.3 milliohm,
to enable applications requiring a programmable low
output voltage at high current and high efficiency.
Closing the loop back to an input Pre-Regulation
Module (PRM) or DC-DC converter may be used to
compensate for ROUT.
A
Peak output current
Case temperature during reflow
Storage temperature
Output power
120
A
208
°C
-40 to 150
144
°C
W
Continuous
For 1 ms
Peak output power
216
W
Thermal Resistance
Symbol
RθJC
Parameter
Typ
1.1
2.1
6.5
5.0
Max
Units
Junction-to-case
Junction-to-BGA
Junction-to-ambient3
Junction-to-ambient4
1.5
2.5
7.2
5.5
°C/W
°C/W
°C/W
°C/W
RθJB
The 1.5V VTM achieves break-through current density
3
RθJA
•
of 320 A/in in a V I Chip package compatible with
standard pick-and-place and surface mount assembly
RθJA
•
processes. The V I Chip BGA package supports in-board
Notes
mounting with a low profile of 0.16" (4mm) over the
board. A J-lead package option supports on-board
surface mounting with a profile of only 0.25" (6mm)
over the board. The VTM’s fast dynamic response and
low noise eliminate the need for bulk capacitance at the
load, substantially increasing the POL density while
improving reliability and decreasing cost.
1. For complete product matrix, see chart on page 10.
2. The referenced junction is defined as the semiconductor having the highest temperature. This
temperature is monitored by the temperature monitor (TM) signal and by a shutdown comparator.
3. V048K015T80 surface mounted in-board to a 2" x 2" FR4 board, 4 layers 2 oz Cu, 300 LFM.
4. V048L015T80 (0.25"H integral Pin Fins) surface mounted on FR4 board, 300 LFM.
Vicor Corporation Tel: 800-735-6200 vicorpower.com
V•I Chip Voltage Transformation Module
Rev. 1.6
Page 1 of 20
45