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V0402MHS22NT

更新时间： 2024-01-16 18:03:25
品牌 Logo 应用领域
力特 - LITTELFUSE 电阻器
页数 文件大小 规格书
4页 248K
描述
Varistor, 9V, 0.1J, Surface Mount, CHIP, 0402, ROHS COMPLIANT

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V0402MHS22NT 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：CHIP, 0402, ROHS COMPLIANT
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8533.40.40.00风险等级：5.59
其他特性：STANDARD: IEC61000-4-2电路直流最大电压：9 V
最大能量吸收容量：0.1 JJESD-609代码：e3
安装特点：SURFACE MOUNT端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE包装方法：TR, PLASTIC, 13 INCH
额定温度：150 °C电阻器类型：VARISTOR
子类别：Non-linear Resistors表面贴装：YES
端子面层：Tin (Sn) - with Nickel (Ni) barrier端子位置：DUAL ENDED
端子形状：WRAPAROUNDBase Number Matches：1

V0402MHS22NT 数据手册

 浏览型号V0402MHS22NT的Datasheet PDF文件第1页浏览型号V0402MHS22NT的Datasheet PDF文件第2页浏览型号V0402MHS22NT的Datasheet PDF文件第4页 
Surface Mount Varistors  
Multilayer High Speed Transient Voltage Surge Suppressor  
MHS Varistor Series  
Soldering Recommendations  
The principal techniques used for the soldering of components in  
surface mount technology are infared (IR) re-flow, vapour phase re-flow  
and wave soldering. Typical profiles are shown in Figures 5, 6 and 7.  
When wave soldering, the MHS suppressor is attached to the circuit  
board by means of an adhesive. The assembly is then placed on a  
conveyor and run through the soldering process to contact the wave.  
With IR and vapour phase re-flow, the device is placed in a solder paste  
on a substrate. As the solder paste is heated, it re-flows and solders the  
unit to the board.  
The recommended solder for the MHS suppressor is a 63/36/2  
(Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also  
recommends an RMA solder flux.  
Wave soldering is the most strenuous of the processes. To avoid the  
possibility of generating stresses due to thermal shock, a preheat stage  
in the soldering process is recommended, and the peak temperature of  
the solder process should be rigidly controlled.  
6.  
When using a re-flow process, care should be taken to ensure that the  
MHS chip is not subjected to a thermal gradient steeper than 4 degrees  
per second; the ideal gradient being 2 degrees per second. During the  
soldering process, preheating within 100 degrees of the solder’s peak  
temperature is essentail to minimize thermal shock. Examples of the sol-  
dering conditions for the MHS suppressor are given in the tables below.  
Once the soldering process has been completed, it is still necessary  
to ensure that any further thermal shocks are avoided. One possible  
cause of thermal shock is hot printed circuit boards being removed  
from the solder process and subjected to cleaning solvents at room  
temperature. The boards must be allowed to cool gradually to less than  
50˚C before cleaning.  
7.  
Recommended Pad Outline  
5.  
TABLE 1: PAD LAYOUT DIMENSIONS  
C
DIMENSION  
A
B
mm  
in  
mm  
mm  
0.067 0.510  
0.760  
in  
in  
0402 1.70  
0603 2.54  
0.024  
0.035  
0.020  
0.030  
0.610  
0.890  
0.100  
154  
www. littelfuse. com  
1234

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