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V0402MHS22 PDF预览

V0402MHS22

更新时间： 2024-02-11 16:34:21
品牌 Logo 应用领域
力特 - LITTELFUSE 电阻器
页数 文件大小 规格书
5页 664K
描述
Varistor, 9V, 0.02J, Surface Mount, CHIP, 0402, ROHS COMPLIANT

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V0402MHS22 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：CHIP, 0402, ROHS COMPLIANT
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8533.40.40.00风险等级：5.59
其他特性：STANDARD: IEC61000-4-2电路直流最大电压：9 V
最大能量吸收容量：0.1 JJESD-609代码：e3
安装特点：SURFACE MOUNT端子数量：2
最高工作温度：125 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE包装方法：TR, PLASTIC, 13 INCH
额定温度：150 °C电阻器类型：VARISTOR
子类别：Non-linear Resistors表面贴装：YES
端子面层：Tin (Sn) - with Nickel (Ni) barrier端子位置：DUAL ENDED
端子形状：WRAPAROUNDBase Number Matches：1

V0402MHS22 数据手册

 浏览型号V0402MHS22的Datasheet PDF文件第1页浏览型号V0402MHS22的Datasheet PDF文件第2页浏览型号V0402MHS22的Datasheet PDF文件第4页浏览型号V0402MHS22的Datasheet PDF文件第5页 
Surface Mount Varistors  
Multilayer High Speed Transient Voltage Surge Suppressor  
RoHS  
MHS Varistor Series  
Soldering Recommendations  
230  
Lead (Pb) Soldering Recommendations  
The principal techniques used for the soldering of components in sur-  
face mount technology are IR Re-flow & Wave soldering. Typical profiles  
are shown in Figures 5 & 6.  
The recommended solder for the ML suppressor is a 62/36/2  
(Sn/Pb/Ag), 60/40 (Sn/Pb) or 63/37 (Sn/Pb). Littelfuse also recommends  
an RMA solder flux.  
3
Wave soldering is the most strenuous of the processes. To avoid the  
possibility of generating stresses due to thermal shock, a preheat stage  
in the soldering process is recommended, and the peak temperature of  
the solder process should be rigidly controlled.  
When using a reflow process, care should be taken to ensure that the  
ML chip is not subjected to a thermal gradient steeper than 4 degrees  
per second; the ideal gradient being 2 degrees per second. During the  
soldering process, preheating to within 100 degrees of the solderís peak  
temperature is essential to minimize thermal shock.  
5.  
Once the soldering process has been completed, it is still necessary to  
ensure that any further thermal shocks are avoided. One possible cause  
of thermal shock is hot printed circuit boards being removed from the  
solder process and subjected to cleaning solvents at room temperature.  
The boards must be allowed to cool gradually to less than 50˚C before  
cleaning.  
6.  
Lead-free (Pb-free) Soldering Recommendations  
MAXIMUM TEMPERATURE 260˚C  
20 - 40 SECONDS WITHIN 5˚C  
Littelfuse offers the Nickel-Barrier termination finish for the optimum Pb-  
free solder performance.  
RAMP RATE  
<3˚C/s  
The preferred solder is 96.5/3.0/0.5 (SnAgCu) with an RMA flux, but  
there is a wide selection of pastes & fluxes available with which the nick-  
el barrier parts should be compatible.  
60 - 150 SEC  
> 217˚C  
The reflow profile must be constrained by maximums shown in Figure 7.  
For Pb-free Wave soldering, Figure 6 still applies.  
PREHEAT ZONE  
Note: the Pb-free paste, flux & profile were used for evaluation purposes  
by Littelfuse, based upon industry standards & practices. There are  
multiple choices of all three available, it is advised that the customer  
explores the optimum combination for their process as processes vary  
considerably from site to site.  
5.0  
6.0  
7.0  
FIGURE 7. LEAD-FREE RE-FLOW PROFILE  
159  
www. littelfuse. com  
12345

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与V0402MHS22相关器件

型号 品牌 描述 获取价格 数据表
V0402MHS22FR LITTELFUSE MULTI-LAYER VARISTOR SURFACE MOU

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V0402MHS22N LITTELFUSE Surface Mount Multilayer Varistors

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V0402MHS22NH LITTELFUSE Varistor, 9V, 0.02J, Surface Mount, CHIP, 0402, ROHS COMPLIANT

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V0402MHS22NR LITTELFUSE Surface Mount Multilayer Varistors (MLVs) > MHS Series

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V0402MHS22NT LITTELFUSE Varistor, 9V, 0.1J, Surface Mount, CHIP, 0402, ROHS COMPLIANT

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