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V0402MHS03N

更新时间： 2024-01-22 10:40:01
品牌 Logo 应用领域
力特 - LITTELFUSE 压敏电阻
页数 文件大小 规格书
5页 185K
描述
Surface Mount Multilayer Varistors

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V0402MHS03N 技术参数

是否无铅： 不含铅是否Rohs认证： 符合
生命周期：Active包装说明：,
Reach Compliance Code：unknownECCN代码：EAR99
HTS代码：8533.40.40.00风险等级：5.04
最大能量吸收容量：0.01 JJESD-609代码：e1
安装特点：SURFACE MOUNT端子数量：2
最高工作温度：150 °C最低工作温度：-55 °C
封装形状：RECTANGULAR PACKAGE包装方法：TR, 13 INCH
额定温度：125 °C电阻器类型：VARISTOR
子类别：Non-linear Resistors表面贴装：YES
端子面层：Tin/Silver/Copper (Sn/Ag/Cu)端子位置：DUAL ENDED
端子形状：WRAPAROUNDBase Number Matches：1

V0402MHS03N 数据手册

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Varistor Products  
Surface Mount Multilayer Varistors (MLVs) > MHS Series  
Device Characteristics  
Speed of Response  
"UꢀMPXꢀDVSSFOUꢀMFWFMTꢅꢀUIFꢀ7ꢁ*ꢀDVSWFꢀPGꢀUIFꢀNVMUJMBZFSꢀ  
transient voltage suppressor approaches a linear (ohmic)  
relationship and shows a temperature dependent effect.  
At or below the maximum working voltage, the suppressor  
is in a high resistance model (approaching 106Ω at its  
maximum rated working voltage). Leakage currents at  
maximum rated voltage are below 100μ"ꢅꢀUZQJDBMMZꢀꢂꢈμA;  
for 0402 size below 20μ"ꢅꢀUZQJDBMMZꢀꢈμA.  
The Multilayer Suppressor is a leadless device. Its  
response time is not limited by the parasitic lead  
inductances found in other surface mount packages.  
The response time of the ZN0ꢀEJFMFDUSJDꢀNBUFSJBMꢀJTꢀMFTTꢀ  
UIBOꢀꢆOTꢀBOEꢀUIFꢀ.-&ꢀDBOꢀDMBNQꢀWFSZꢀGBTUꢀE7ꢇE5ꢀFWFOUTꢀ  
such as ESD. Additionally, in “real world” applications,  
the associated circuit wiring is often the greatest  
factor effecting speed of response. Therefore, transient  
suppressor placement within a circuit can be considered  
important in certain instances.  
TypicalTemperature Dependance of the Characteristic  
$VSWFꢀJOꢀUIFꢀ-FBLBHFꢀ3FHJPO  
Multilayer Internal Construction  
100%  
FIRED CERAMIC  
DIELECTRIC  
METAL  
ELECTRODES  
METAL END  
TERMINATION  
DEPLETION  
REGION  
o
o
o
o
o
C
25 50 75  
-8 -7  
100 125  
10%  
1E  
DEPLETION  
REGION  
-9  
-6  
-5  
-4  
-3  
-2  
1E  
1E  
1E  
1E  
1E  
1E  
1E  
Figure 5  
Figure 6  
SUPPRESSOR CURRENT (A  
DC  
)
GRAINS  
Lead (Pb) Soldering Recommendations  
The principal techniques used for the soldering of  
Reflow Solder Profile  
DPNQPOFOUTꢀJOꢀTVSGBDFꢀNPVOUꢀUFDIOPMPHZꢀBSFꢀ*3ꢀ3FꢁnPXꢀ  
and Wave soldering. Typical profiles are shown on the right.  
The recommended solder for the MHS suppressor is  
Bꢀꢏꢂꢇꢄꢏꢇꢂꢀꢊ4Oꢇ1Cꢇ"Hꢋꢅꢀꢏꢃꢇꢎꢃꢀꢊ4Oꢇ1CꢋꢀPSꢀꢏꢄꢇꢄꢒꢀꢊ4Oꢇ1Cꢋꢍꢀ  
-JUUFMGVTFꢀBMTPꢀSFDPNNFOETꢀBOꢀ3."ꢀTPMEFSꢀnVYꢍ  
230  
Wave soldering is the most strenuous of the processes.  
To avoid the possibility of generating stresses due to  
thermal shock, a preheat stage in the soldering process  
is recommended, and the peak temperature of the solder  
process should be rigidly controlled.  
When using a reflow process, care should be taken to  
ensure that the MHS chip is not subjected to a thermal  
gradient steeper than 4 degrees per second; the ideal  
gradient being 2 degrees per second. During the soldering  
QSPDFTTꢅꢀQSFIFBUJOHꢀUPꢀXJUIJOꢀꢆꢃꢃꢀEFHSFFTꢀPGꢀUIFꢀTPMEFShTꢀ  
peak temperature is essential to minimize thermal shock.  
Figure 7  
Wave Solder Profile  
0ODFꢀUIFꢀTPMEFSJOHꢀQSPDFTTꢀIBTꢀCFFOꢀDPNQMFUFEꢅꢀJUꢀJTꢀ  
still necessary to ensure that any further thermal shocks  
BSFꢀBWPJEFEꢍꢀ0OFꢀQPTTJCMFꢀDBVTFꢀPGꢀUIFSNBMꢀTIPDLꢀJTꢀIPUꢀ  
printed circuit boards being removed from the solder  
process and subjected to cleaning solvents at room  
temperature. The boards must be allowed to cool gradually  
UPꢀMFTTꢀUIBOꢀꢈꢃ$ꢀCFGPSFꢀDMFBOJOHꢍ  
Figure 8  
©2009 Littelfuse, Inc.  
27  
Revision: July 16, 2009  
MHSVaristor Series  
Specifications are subject to change without notice.  
Please refer to www.littelfuse.com/series/MHS.html for current information.  
12345

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