SPICE MODELS: US1A US1B US1D US1G US1J US1K US1M
US1A - US1M
1.0A SURFACE MOUNT ULTRA-FAST RECTIFIER
Features
·
·
·
·
·
·
Glass Passivated Die Construction
Ultra-Fast Recovery Time for High Efficiency
Surge Overload Rating to 30A Peak
High Current Capability
Ideally Suited for Automated Assembly
Lead Free Finish/RoHS Compliant (Note 4)
B
SMA
Dim
A
Min
2.29
4.00
1.27
0.15
4.80
0.10
0.76
2.01
Max
2.92
4.60
1.63
0.31
5.59
0.20
1.52
2.62
Mechanical Data
A
C
B
·
Case: SMA
C
·
Case Material: Molded Plastic. UL Flammability Classification
Rating 94V-0
D
D
·
·
Moisture Sensitivity: Level 1 per J-STD-020C
Terminals: Lead Free Plating (Matte Tin Finish).
E
J
G
H
e3
Solderable per MIL-STD-202, Method 208
·
·
·
·
Polarity: Cathode Band or Cathode Notch
Marking: Type Number & Date Code: See Page 3
Ordering Information: See Page 3
G
H
J
E
All Dimensions in mm
Weight: 0.064 grams (approximate)
TA = 25°C unless otherwise specified
Maximum Ratings and Electrical Characteristics
Single phase, half wave, 60Hz, resistive or inductive load. For capacitive load, derate current by 20%.
Characteristic
Symbol US1A US1B US1D US1G US1J US1K US1M Unit
VRRM
VRWM
VR
VR(RMS)
IO
Peak Repetitive Reverse Voltage
Working Peak Reverse Voltage
DC Blocking Voltage (Note 5)
50
35
100
70
200
140
400
600
420
800
560
1000
700
V
RMS Reverse Voltage
280
1.0
V
A
Average Rectified Output Current
Non-Repetitive Peak Forward Surge Current
8.3ms Single half sine-wave Superimposed on Rated Load
@ TT = 75°C
IFSM
VFM
IRM
30
A
V
Forward Voltage Drop
@ IF = 1.0A
1.0
1.3
1.7
5.0
100
Peak Reverse Current
at Rated DC Blocking Voltage (Note 5)
@ TA = 25°C
@ TA = 100°C
mA
trr
Reverse Recovery Time (Note 2)
Typical Total Capacitance (Note 1)
50
20
75
10
ns
pF
CT
R
Typical Thermal Resistance, Junction to Terminal
Operating and Storage Temperature Range
30
°C/W
°C
qJT
Tj, TSTG
-65 to +150
Notes: 1. Measured with I = 0.5A, I = 1.0A, I = 0.25A. See figure 5.
F
R
rr
2. Measured at 1.0MHz and applied reverse voltage of 4.0V DC.
2
3. Unit mounted on PC board with 5.0 mm (0.013 mm thick) copper pad as heat sink.
4. RoHS revision 13.2.2003. Glass and high temperature solder exemptions applied, see EU Directive Annex Notes 5 and 7.
5. Short duration pulse test used to minimize self-heating effect.
DS16008 Rev. 7 - 2
1 of 3
US1A - US1M
www.diodes.com
ã Diodes Incorporated