Datasheet > U0408FC08C

U0408FC08C

更新时间： 2024-02-14 04:02:11

品牌	Logo	应用领域
PROTEC		/
页数	文件大小	规格书
6页	112K
描述
UNBUMPED FLIP CHIP ARRAY

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数据手册

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U0408FC08C 数据手册

U0408FC3.3C

thru

U0408FC36C

APPLICATION INFORMATION

PRINTED CIRCUIT BOARD RECOMMENDATIONS

PARAMETER

VALUE

Pad Size on PCB

0.275mm

Round

Pad Shape

Pad Definition

Non-Solder Mask Defined Pads

0.325mm Round

0.150mm

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (laser cut, 5% tapered walls)

Solder Paste Type

0.330mm Round

No Clean

Pad Protective Finish

OSP(Entek Cu Plus 106A)

±50µm

Tolerance - Edge To Corner Ball

Solder Ball Side Coplanarity

Maximum Dwell Time Above Liquidous (183°C)

Soldering Maximum Temperature

±20µm

60 Seconds

270°C

RECOMMENDED NON-SOLDER MASK

DEFINED PAD ILLUSTRATION

REQUIREMENTS

Non-Solder Mask Defined Pad

0.275mm DIA.

Temperature:

T_Pfor Lead-Free (SnAgCu): 260-265°C

T_Pfor Tin-Lead: 240-245°C

Preheat time and temperature depends on solder paste and flux

activation temperature, component size, weight, surface area &

plating.

Solder Mask Opening

0.325mm DIA.

Solder Stencil Opening

0.330mm DIA.

T_P

Ramp-up

Ramp-down

T_L

T_SMAX

155°

T_SMIN

140°

T_S- Preheat

t 25°C to Peak

30-60 seconds

Ramp-up

15 seconds

Solder Time

15-20 seconds

Ramp-down

05161.R4 3/05

www.protekdevices.com

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