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U0406FC24C-T75-2 PDF预览

U0406FC24C-T75-2

更新时间: 2024-02-02 23:23:55
品牌 Logo 应用领域
PROTEC 局域网二极管
页数 文件大小 规格书
6页 76K
描述
Trans Voltage Suppressor Diode, 250W, 24V V(RWM), Bidirectional, 6 Element, Silicon, FLIP CHIP-6

U0406FC24C-T75-2 技术参数

是否Rohs认证: 不符合生命周期:Obsolete
零件包装代码:FLIP-CHIP包装说明:R-XBCC-N6
针数:6Reach Compliance Code:compliant
ECCN代码:EAR99HTS代码:8541.10.00.50
风险等级:5.87最小击穿电压:26.7 V
最大钳位电压:55 V配置:COMMON BIPOLAR TERMINAL, 6 ELEMENTS
二极管元件材料:SILICON二极管类型:TRANS VOLTAGE SUPPRESSOR DIODE
JESD-30 代码:R-XBCC-N6JESD-609代码:e0
湿度敏感等级:1最大非重复峰值反向功率耗散:250 W
元件数量:6端子数量:6
封装主体材料:UNSPECIFIED封装形状:RECTANGULAR
封装形式:CHIP CARRIER峰值回流温度(摄氏度):245
极性:BIDIRECTIONAL认证状态:Not Qualified
最大重复峰值反向电压:24 V子类别:Transient Suppressors
表面贴装:YES技术:AVALANCHE
端子面层:Tin/Lead (Sn/Pb)端子形式:NO LEAD
端子位置:BOTTOM处于峰值回流温度下的最长时间:NOT SPECIFIED
Base Number Matches:1

U0406FC24C-T75-2 数据手册

 浏览型号U0406FC24C-T75-2的Datasheet PDF文件第1页浏览型号U0406FC24C-T75-2的Datasheet PDF文件第2页浏览型号U0406FC24C-T75-2的Datasheet PDF文件第3页浏览型号U0406FC24C-T75-2的Datasheet PDF文件第5页浏览型号U0406FC24C-T75-2的Datasheet PDF文件第6页 
U0406FC3.3C  
thru  
U0406FC36C  
APPLICATION INFORMATION  
PRINTED CIRCUIT BOARD RECOMMENDATIONS  
PARAMETER  
VALUE  
Pad Size on PCB  
Pad Shape  
0.275mm  
Round  
Pad Definition  
Non-Solder Mask Defined Pads  
0.325mm Round  
0.150mm  
Solder Mask Opening  
Solder Stencil Thickness  
Solder Stencil Aperture Opening (laser cut, 5% tapered walls)  
Solder Paste Type  
0.330mm Round  
No Clean  
Pad Protective Finish  
OSP(Entek Cu Plus 106A)  
50µm  
Tolerance - Edge To Corner Ball  
Solder Ball Side Coplanarity  
20µm  
Maximum Dwell Time Above Liquidous (183°C)  
Soldering Maximum Temperature  
60 Seconds  
270°C  
RECOMMENDED NON-SOLDER MASK  
DEFINED PAD ILLUSTRATION  
REQUIREMENTS  
Non-Solder Mask Defined Pad  
0.275mm DIA.  
Temperature:  
TP for Lead-Free (SnAgCu): 260-270°C  
TP for Tin-Lead: 240-245°C  
Preheat time and temperature depends on solder paste and flux  
activation temperature, component size, weight, surface area &  
plating.  
Solder Mask Opening  
0.325mm DIA.  
Solder Stencil Opening  
0.330mm DIA.  
TP  
Ramp-up  
Ramp-down  
T
L
TSMAX  
155°  
TSMIN  
140°  
TS - Preheat  
t 25°C to Peak  
30-60 seconds  
Ramp-up  
15 seconds  
Solder Time  
15-20 seconds  
Ramp-down  
05160.R4 5/07  
www.protekdevices.com  
4

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