Datasheet > U0402FC3.3C-LF-T75-1

U0402FC3.3C-LF-T75-1

更新时间： 2023-02-26 14:45:05

品牌	Logo	应用领域
PROTEC		/
页数	文件大小	规格书
8页	572K
描述
Trans Voltage Suppressor Diode, 250W, 3.3V V(RWM), Bidirectional, 1 Element, Silicon, ROHS AND REACH COMPLIANT, FLIP CHIP-4

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U0402FC3.3C-LF-T75-1 数据手册

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U0402FC3.3C - U0402FC36C

Only One Name Means ProTek’Tion™

ꢇꢉlꢃꢂR RꢂFlꢉꢀ ꢄnFꢉRꢁꢈꢅꢄꢉn

PRꢄnꢅꢂꢃ CꢄRCUꢄꢅ bꢉꢈRꢃ RꢂCꢉꢁꢁꢂnꢃꢈꢅꢄꢉnꢇ

PꢈRꢈꢁꢂꢅꢂR

ꢆꢈlUꢂ

0.275mm

Pad Size on PCB

Pad Shape

Round

Pad Deﬁniꢀon

Non-Solder Mask Deﬁned Pads

0.325mm Round

0.150mm

Solder Mask Opening

Solder Stencil Thickness

Solder Stencil Aperture Opening (Laser cut, 5% tapered walls)

Solder Paste Type

0.330mm Round

No Clean

Pad Protecꢀve Finish

OSP (Entek Cu Plus 106A)

±50µm

Tolerance - Edge To Corner Ball

Solder Ball Side Coplanarity (Only applies to bumped devices)

Maximum Dwell Time Above Liquidous (183°C)

Soldering Maximum Temperature

±20µm

60 seconds

270°C

RꢂqUꢄRꢂꢁꢂnꢅꢇ

RꢂCꢉꢁꢁꢂnꢃꢂꢃ nꢉnꢏꢇꢉlꢃꢂR ꢁꢈꢇꢊ

ꢃꢂFꢄnꢂꢃ Pꢈꢃ ꢄllUꢇꢅRꢈꢅꢄꢉn

noꢌ-ꢇoꢍder ꢁask ꢃeﬁꢌed Pad

0.275mm ꢃꢄꢈ.

Temperature:

T_Pfor Lead-Free (Sn/Ag/Cu): 260-270°C

Preheat ꢀme and temperature depends on solder paste and ﬂux acꢀva-

ꢀon temperature, component size, weight, surface area and plaꢀng.

ꢇoꢍder ꢁask ꢉpeꢌiꢌg

0.325mm ꢃꢄꢈ.

ꢇoꢍder ꢇteꢌciꢍ ꢉpeꢌiꢌg

0.330mm ꢃꢄꢈ.

ꢁaximum ꢇoꢍder Reﬂow

(35-53°C ꢈꢕove ꢁaximum ꢇoꢍder ꢁeꢍt ꢅemp)

ꢅ_P

ꢇoꢍder ꢁeꢍt

(ꢁaximum ꢅemp)

Ramp-Up

Ramp-ꢃowꢌ

Preꢎeat

(ꢇtaꢖ beꢍow Fꢍux ꢈcꢓvaꢓoꢌ ꢅemp)

30-60 secoꢌds

Ramp-Up

15 secoꢌds

(ꢁiꢌimize)

ꢇoꢍder-ꢅime

15-20 secoꢌds

Ramp-ꢃowꢌ

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