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TQC0015 PDF预览

TQC0015

更新时间: 2024-02-08 15:22:06
品牌 Logo 应用领域
TRIQUINT 光电二极管
页数 文件大小 规格书
7页 1317K
描述
High Isolation, Absorptive SPDT Switch

TQC0015 数据手册

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TQC0015  
High Isolation, Absorptive SPDT Switch  
Package Marking and Dimensions  
Pin #1 IDENTIFIER  
CHAMFER 0.300 x 45°  
4.000±0.050  
16X 0.65 Pitch  
16X 0.30±0.05  
16X 0.40±0.05  
TERMINAL #1  
IDENTIFIER  
0015  
YYWW  
XXXXXX  
Package Marking  
Product Identifier: 0015  
Date Code: YYWW  
2.50±0.05  
Exp. DAP  
4.000±0.050  
1.95 Ref.  
Assembly Code: XXXXXX  
GND/THERMAL PAD  
2.50±0.05  
Exp. DAP  
.10  
.08  
C
C
.850±0.050  
C
16X  
SEATING PLANE  
0.000  
0.050  
.203 Ref.  
Notes:  
1. All dimensions are in millimeters. Angles are in degrees.  
2. Except where noted, this part outline conforms to JEDEC standard MO-220, Issue E (Variation VGGC) for thermally enhanced  
plastic very thin fine pitch quad flat no lead package (QFN).  
3. Dimension and tolerance formats conform to ASME Y14.4M-1994.  
4. The terminal #1 identifier and terminal numbering conform to JESD 95-1 SPP-012  
5. Contact plating: NiPdAu  
PCB Mounting Pattern  
0.65 PITCH  
PACKAGE  
OUTLINE  
3
12X  
16X 0.40  
1
R.19  
0.27  
1
16X 0.80  
2.30  
0.64  
0.55  
2.30  
COMPONENT SIDE  
Notes:  
1. All dimensions are in millimeters. Angles are in degrees.  
2. Use 1 oz. copper minimum for top and bottom layer metal.  
3. We recommend a 0.35mm (#80/.0135") diameter bit for drilling via holes and a final plated thru diameter of 0.25 mm (0.10”).  
4. Ensure good package backside paddle solder attach for reliable operation and best electrical performance.  
Data Sheet Rev. H 09-17-14  
Disclaimer: Subject to change without notice  
- 6 of 7 -  
© 2014 TriQuint  
www.triquint.com  

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