TMMDB3

更新时间： 2024-01-07 12:06:38

品牌	Logo	应用领域
意法半导体 - STMICROELECTRONICS		数据判读及分析中心
页数	文件大小	规格书
4页	54K
描述
DIAC

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中文翻译

获取价格

技术参数
数据手册

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TMMDB3 技术参数

是否无铅：	不含铅	是否Rohs认证：	符合
生命周期：	Active	零件包装代码：	MELF
包装说明：	MINI MELF-2	针数：	2
Reach Compliance Code：	unknown	风险等级：	5.83

TMMDB3 数据手册

TMMDB3

Fig. 3: Time duration while current pulse is higher

50mA versus C and Rs (typical values).

tp(µs)

Tj=25°C

68Ω

47Ω

33Ω

22Ω

10Ω

C(nF)

0Ω

100

200

500

PACKAGE MECHANICAL DATA (in millimeters)

MINIMELF

REF.

DIMENSIONS

Millimeters Inches

Min. Typ. Max. Min. Typ. Max.

3.30

1.59

0.40

3.40

1.60

0.45

1.50

3.6

0.130 0.134 0.142

1.62 0.063 0.063 0.064

0.50 0.016 0.018 0.020

0.059

0.05 E-F

FOOTPRINT

2.5

Information furnished is believed to be accurate and reliable. However, STMicroelectronics assumes no responsibility for the consequences of

use of such information nor for any infringement of patents or other rights of third parties which may result from its use. No license is granted by

implication or otherwise under any patent or patent rights of STMicroelectronics. Specifications mentioned in this publication are subject to

change without notice. This publication supersedes and replaces all information previously supplied.

STMicroelectronics products are not authorized for use as critical components in life support devices or systems without express written ap-

proval of STMicroelectronics.

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