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THJP

更新时间: 2023-12-06 20:03:05
品牌 Logo 应用领域
威世 - VISHAY /
页数 文件大小 规格书
4页 158K
描述
ThermaWick? Thermal Jumper Surface Mount Chip

THJP 数据手册

 浏览型号THJP的Datasheet PDF文件第2页浏览型号THJP的Datasheet PDF文件第3页浏览型号THJP的Datasheet PDF文件第4页 
THJP  
Vishay Dale Thin Film  
www.vishay.com  
ThermaWick® Thermal Jumper Surface Mount Chip  
FEATURES  
• Electrically isolated thermal conductor  
• High thermal conductivity AlN substrate  
(170 W/mK)  
Available  
Available  
• Electrically isolated terminations (> 999 MΩ)  
• Low capacitance  
• Available with SnPb or lead (Pb)-free wrap  
terminations  
Available  
• AEC-Q200 qualified  
• Material categorization: for definitions of compliance  
please see www.vishay.com/doc?99912  
LINKS TO ADDITIONAL RESOURCES  
3
D
3
D
APPLICATIONS  
• Power supplies and converters  
• RF amplifiers  
3D Models  
Infographics  
Videos  
THJP surface mount chips are designed to provide an  
electrically isolated thermal conductive pathway to a ground  
plane or heat sink while maintaining the electrical isolation of  
the device. The devices are constructed with aluminum  
nitride substrates in both SnPb and Pb-free wraparound  
termination styles. The low capacitance of the device makes  
them an excellent choice for high frequency and thermal  
ladder applications. Custom sizes available.  
• Synthesizers  
• Switch mode power supplies  
• Pin and laser diodes  
• Filters  
CONSTRUCTION  
FUNCTIONAL APPLICATIONS /  
CONNECTION OPTIONS  
Solder coating  
• Component to heat sink  
• Component to case  
• Component to ground plane  
• Pad to pad  
Nickel termination  
Aluminum nitride  
substrate  
• Pad to via  
• Pad to trace  
HEAT TRANSFER DEMONSTRATION  
Chip surface temperature was measured using a FLIR SC645 thermal imaging system under ambient conditions. The devices  
were mounted to an FR4 test card designed with a 25 mm x 19 mm copper heat sink. Power was supplied to device to cause  
the surface temperature to stabilize at 150 °C. The device was then retested at the same power level with the thermal jumper  
connecting the device to the heat sink.  
Example THJP 1206 Thermal Jumper Showing 36 % Surface Temperature Reduction  
Thermal jumper location  
Ceramic Resistor Chip Without Thermal Jumper (149.8 °C)  
Revision: 30-Sep-2022  
Ceramic Chip Resistor With Thermal Jumper (95.5 °C)  
Document Number: 60157  
1
For technical questions, contact: thinfilm@vishay.com  
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT  
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000  

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